Datasheet

AD9737A/AD9739A Data Sheet
Rev. | Page 8 of 64
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
VDDA to VSSA −0.3 V to +3.6 V
VDD33 to VSS
−0.3 V to +3.6 V
VDD to VSS −0.3 V to +1.98 V
VDDC to VSSC −0.3 V to +1.98 V
VSSA to VSS −0.3 V to +0.3 V
VSSA to VSSC −0.3 V to +0.3 V
VSS to VSSC −0.3 V to +0.3 V
DACCLK_P, DACCLK_N to VSSC
−0.3 V to VDDC + 0.18 V
DCI, DCO to VSS −0.3 V to VDD33 + 0.3 V
LVDS Data Inputs to VSS −0.3 V to VDD33 + 0.3 V
IOUTP, IOUTN to VSSA −1.0 V to VDDA + 0.3 V
I120, VREF to VSSA −0.3 V to VDDA + 0.3 V
IRQ, CS, SCLK, SDO, SDIO, RESET to VSS
−0.3 V to VDD33 + 0.3 V
Junction Temperature 150°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 6. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
160-Ball CSP_BGA 31.2 7.0 °C/W
1
1
With no airflow movement.
ESD CAUTION
C