Datasheet

ADCLK950
Rev. A | Page 12 of 12
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
082708-A
OUTLINE DIMENSIONS
1
40
10
11
29
28
20
19
3.05
2.90 SQ
2.75
TOP VIEW
6.00
BSC SQ
5.75
BSC SQ
COPLANARITY
0.08
4.50
REF
0.50
0.40
0.30
0.50
BSC
PIN 1
INDICATOR
0.60 MAX
0.60 MAX
0.25 MIN
EXPOSED
PAD
BOTTOM VIEW
PIN 1
INDICATOR
0.30
0.23
0.18
0.20 REF
12° MAX
0.80 MAX
0.65 TYP
1.00
0.85
0.80
0.05 MAX
0.02 NOM
S
EATING
PLANE
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 24. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
ADCLK950BCPZ −40°C to +85°C 40-Lead LFCSP_VQ CP-40-8
ADCLK950BCPZ-REEL7 −40°C to +85°C 40-Lead LFCSP_VQ CP-40-8
ADCLK950/PCBZ Evaluation Board
1
Z = RoHS Compliant Part.
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D08279-0-6/10(A)