Datasheet

ADCLK950
Rev. A | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage
V
CC
− V
EE
6 V
Input Voltage
CLK0, CLK1, CLK0, CLK1, IN_SEL V
EE
− 0.5 V to
V
CC
+ 0.5 V
CLK0, CLK1, CLK0, CLK1 to V
T
x Pin (CML,
LVPECL Termination)
±40 mA
CLK0, CLK1 to CLK0, CLK1
±1.8 V
Input Termination, V
T
x to CLK0, CLK1, CLK0,
and CLK1
±2 V
Maximum Voltage on Output Pins V
CC
+ 0.5 V
Maximum Output Current 35 mA
Voltage Reference (V
REF
x) V
CC
to V
EE
Operating Temperature Range
Ambient −40°C to +85°C
Junction 150°C
Storage Temperature Range −65°C to +150°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
T
J
= T
CASE
+ (Ψ
JT
× P
D
)
where:
T
J
is the junction temperature (°C).
T
CASE
is the case temperature (°C) measured by the customer at
the top center of the package.
Ψ
JT
is from Table 6.
P
D
is the power dissipation.
Valu es of θ
JA
are provided for package comparison and PCB
design considerations. θ
JA
can be used for a first-order approxi-
mation of T
J
by the equation
T
J
= T
A
+ ( θ
JA
× P
D
)
where T
A
is the ambient temperature (°C).
Valu es of θ
JB
are provided in Table 6 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter Symbol Description Value
1
Unit
Junction-to-Ambient Thermal Resistance
θ
JA
Still Air Per JEDEC JESD51-2
0 m/sec Air Flow 46.1 °C/W
Moving Air
θ
JMA
Per JEDEC JESD51-6
1 m/sec Air Flow 40.3 °C/W
2.5 m/sec Air Flow 36.2 °C/W
Junction-to-Board Thermal Resistance
θ
JB
Moving Air Per JEDEC JESD51-8
1 m/sec Air Flow 28.7 °C/W
Junction-to-Case Thermal Resistance
θ
JC
Moving Air Per MIL-STD 883, Method 1012.1
Die-to-Heatsink 8.3 °C/W
Junction-to-Top-of-Package Characterization Parameter
Ψ
JT
Still Air Per JEDEC JESD51-2
0 m/sec Air Flow 0.6 °C/W
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.