Datasheet

Data Sheet ADP151
Rev. E | Page 19 of 24
In the case where the board temperature is known, use the
thermal characterization parameter, Ψ
JB
, to estimate the
junction temperature rise (see Figure 57 and Figure 58).
Maximum junction temperature (T
J
) is calculated from the
board temperature (T
B
) and power dissipation (P
D
) using the
following formula:
T
J
= T
B
+ (P
D
× Ψ
JB
) (5)
The typical value of Ψ
JB
is 58°C/W for the 4-ball WLCSP package,
43°C/W for the 5-lead TSOT package, and 28.3°C/W for the 6-lead
LFCSP package.
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8
V
IN
– V
OUT
(V)
JUNCTION TEMPERATURE, T
J
(°C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCTION TEMPERATURE
08627-043
Figure 57. WLCSP, T
A
= 85°C
140
120
100
80
60
40
20
0
0.3 4.84.33.83.32.82.31.81.30.8
V
IN
– V
OUT
(V)
JUNCTION TEMPERATURE, T
J
(°C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCTION TEMPERATURE
08627-044
Figure 58. TSOT, T
A
= 85°C
140
120
100
80
60
40
20
0
0.3 5.34.33.32.3
1.3
V
IN
– V
OUT
(V)
JUNCTION TEMPERATURE, T
J
(°C)
I
LOAD
= 1mA
I
LOAD
= 10mA
I
LOAD
= 50mA
I
LOAD
= 100mA
I
LOAD
= 150mA
I
LOAD
= 200mA
MAXIMUM JUNCTION TEMPERATURE
08627-059
Figure 59. LFCSP, T
A
= 85°C