Datasheet

ADP151 Data Sheet
Rev. E | Page 20 of 24
PRINTED CIRCUIT BOARD LAYOUT CONSIDERATIONS
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP151.
However, as listed in Table 6, a point of diminishing returns
is eventually reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
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Figure 60. Example TSOT PCB Layout
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Figure 61. Example WLCSP PCB Layout
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Figure 62. Example LFCSP PCB Layout