Datasheet

ADP160/ADP161/ADP162/ADP163 Data Sheet
Rev. H | Page 20 of 24
OUTLINE DIMENSIONS
100708-A
*
COMPLIANT TO JEDEC STANDARDS MO-193-AB WITH
THE EXCEPTION OF PACKAGE HEIGHT AND THICKNESS.
1.60 BSC
2.80 BSC
1.90
BSC
0.95 BSC
0.20
0.08
0.60
0.45
0.30
8°
4°
0°
0.50
0.30
0.10 MAX
*
1.00 MAX
*
0.90 MAX
0.70 MIN
2.90 BSC
5 4
1 2 3
SEATING
PLANE
Figure 53. 5-Lead Thin Small Outline Transistor Package [TSOT]
(UJ-5)
Dimensions shown in millimeters
1.000
0.965 SQ
0.925
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
A
12
B
BALL A1
IDENTIFIER
0.50
REF
0.640
0.595
0.550
END VIEW
0.340
0.320
0.300
0.370
0.355
0.340
SEATING
PLANE
0.270
0.240
0.210
COPLANARITY
0.03
04-17-2012-A
Figure 54. 4-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-4-1)
Dimensions shown in millimeters