Datasheet

ADP170/ADP171 Data Sheet
Rev. C | Page 16 of 20
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
Heat dissipation from the package can be improved by
increasing the amount of copper attached to the pins of the
ADP170/ADP171. However, as can be seen from Table 6, a
point of diminishing returns is eventually reached, beyond
which an increase in the copper size does not yield significant
heat dissipation benefits.
Place the input capacitor as close as possible to the VIN and
GND pins. Place the output capacitor as close as possible to the
VOUT and GND pins. Use of 0402 or 0603 size capacitors and
resistors achieves the smallest possible footprint solution on
boards where area is limited.
J1
ANALOG DEVICES
ADP170-x.x-EVALZ
V
I
N
V
O
UT
GND
EN
G
ND
C1
C2
G
ND
GND
U1
07716-035
Figure 40. Example ADP170 PCB Layout
J1
ANALOG DEVICES
ADP171-x.x-EVALZ
VIN
VOUT
GND
EN
GND
C1
C2
GND
GND
U1
R 2
R 1
07716-036
Figure 41. Example ADP171 PCB Layout