Datasheet

ADP1715/ADP1716
Rev. 0 | Page 15 of 20
140
0
0
06110-031
V
IN
– V
OUT
(V)
T
J
(°C)
5
120
100
80
60
40
20
1234
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
DO NOT OPERATE ABOVE THIS POINT
MAX T
J
Figure 43. 300 mm
2
of PCB Copper, T
A
= 85°C
140
0
05
06110-032
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1234
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
DO NOT OPERATE ABOVE THIS POINT
MAX T
J
Figure 44. 100 mm
2
of PCB Copper, T
A
= 85°C
140
0
05
06110-033
V
IN
– V
OUT
(V)
T
J
(°C)
120
100
80
60
40
20
1234
1mA
10mA
50mA
100mA
250mA
360mA
500mA
(LOAD CURRENT)
DO NOT OPERATE ABOVE THIS POINT
MAX T
J
Figure 45. 0 mm
2
of PCB Copper, T
A
= 85°C
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
The 8-lead MSOP package has the four GND pins fused together
internally, which enhances its thermal characteristics. Heat
dissipation from the package is increased by connecting as much
copper as possible to the four GND pins of the ADP1715/
ADP1716. From
Table 5 it can be seen that a point of
diminishing returns eventually is reached, beyond which an
increase in the copper size does not yield additional heat
dissipation benefits.
Figure 46 shows a typical layout for the ADP1715/ADP1716.
The four GND pins are connected to a large copper pad. If a
second layer is available, multiple vias can be used to connect
them, increasing the overall copper area. The input capacitor
should be placed as close as possible to the IN and GND pins.
The output capacitor should be placed as close as possible to the
OUT and GND pins. 0603 or 0402 size capacitors and resistors
should be used to achieve the smallest possible footprint
solution on boards where area is limited.
GND (TOP)
GND (BOTTOM)
C1 C2
C3
R2
R1
EN
IN
OUT
ADP1715/
ADP1716
06110-048
Figure 46. Example PCB Layout