Datasheet

ADP1720
Rev. A | Page 14 of 16
PRINTED CIRCUIT BOARD LAYOUT
CONSIDERATIONS
R1
C2C1
ADP1720
IN OUT
GND (TOP)
R2
EN
GND (BOTTOM)
06111-028
Heat dissipation from the package can be improved by increasing
the amount of copper attached to the pins of the ADP1720. How-
ever, as can be seen from Table 5, a point of diminishing returns
eventually is reached, beyond which an increase in the copper
size does not yield significant heat dissipation benefits.
Place the input capacitor as close as possible to the IN and GND
pins. Place the output capacitor as close as possible to the OUT
and GND pins. Use of 0402 or 0603 size capacitors and resistors
achieves the smallest possible footprint solution on boards
where area is limited.
Figure 28. Example PCB Layout