Datasheet

EVAL-ADP1740/ADP1741
Rev. 0 | Page 9 of 12
140
120
100
80
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0
JUNCTION TEMPERATURE,
T
J
(°C)
V
IN
– V
OUT
(V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 250mA
LOAD = 500mA
LOAD = 1A
LOAD = 2A
07154-038
Figure 15. 500 mm
2
of PCB Copper, T
A
= 50°C, LFCSP
140
120
100
80
60
40
20
0
0.5 1.0 1.5 2.0 2.5 3.0
JUNCTION TEMPERATURE,
T
J
(°C)
V
IN
– V
OUT
(V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 250mA
LOAD = 500mA
LOAD = 1A
07154-039
Figure 16. 0 mm
2
of PCB Copper, T
A
= 50°C, LFCSP
In cases where the board temperature is known, the thermal
characterization parameter, Ψ
JB
, can be used to estimate the
junction temperature rise. Maximum junction temperature (T
J
)
is calculated from the board temperature (T
B
) and power dissi-
pation (P
D
) using the following formula:
T
J
= T
B
+ (P
D
× Ψ
JB
) (4)
140
120
100
80
60
40
20
0
0.25 0.75 1.25 1.75 2.25 2.75
JUNCTION TEMPERATURE,
T
J
(°C)
V
IN
– V
OUT
(V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 250mA
LOAD = 500mA
LOAD = 1A
LOAD = 2A
07154-040
Figure 17. 500 mm
2
of PCB Copper, T
B
= 25°C, LFCSP
140
120
100
80
60
40
20
0
0.25 0.75 1.25 1.75 2.25 2.75
JUNCTION TEMPERATURE,
T
J
(°C)
V
IN
– V
OUT
(V)
MAX JUNCTION
TEMPERATURE
LOAD = 10mA
LOAD = 100mA
LOAD = 250mA
LOAD = 500mA
LOAD = 1A
LOAD = 2A
07154-041
Figure 18. 500 mm
2
of PCB Copper, T
B
= 50°C, LFCSP