Datasheet

Data Sheet ADP1822
Rev. D | Page 5 of 24
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
VCC, SHDN, SYNC, FREQ, COMP, SS, FB,
TRKP, TRKN, MAR, MSEL, MUP, and
MDN to GND; PVCC to PGND; BST to SW
−0.3 V to +6 V
BST to GND −0.3 V to +30 V
CSL to GND −1 V to +30 V
DH to GND
(V
SW
− 0.3 V) to
(V
BST
+ 0.3 V)
DL to PGND
−0.3 V to
(V
PVCC
+ 0.3 V)
SW to GND −2 V to +30 V
PGND to GND
±2 V
θ
JA
, 2-Layer (SEMI Standard Board) 122°C/W
θ
JA
, 4-Layer (JEDEC Standard Board)
82°C/W
Operating Ambient Temperature Range −40°C to +85°C
Operating Junction Temperature Range −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Soldering Lead Temperature 260°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Absolute maximum ratings apply individually only, not in
combination. Unless otherwise specified, all other voltages are
referenced to GND.
ESD CAUTION