Datasheet

ADP3335 Data Sheet
Rev. D | Page 12 of 16
OUTLINE DIMENSIONS
TOP VIEW
8
1
5
4
0
.3
0
0
.
25
0.
20
BOTTOM VIEW
PIN 1 I
N
DE
X
AREA
SEATING
PLANE
0.
80
0.
75
0.70
1
.
5
5
1
.4
5
1
.3
5
1
.
84
1.74
1
.6
4
0
.
20
3 RE
F
0
.
0
5
M
A
X
0.
02
N
OM
0
.5
0
BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT
TO JEDEC STANDARDS MO-229-WEED
12-07-2010-A
PIN 1
INDICATOR
(R 0.15)
Figure 26. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-13)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-187-AA
100709-B
6°
0°
0.80
0.55
0.40
4
8
1
5
0.65 BSC
0.40
0.25
1.10 MAX
3.20
3.00
2.80
COPLANARITY
0.10
0.23
0.09
3.20
3.00
2.80
5.15
4.90
4.65
PIN 1
IDENTIFIER
15° MAX
0.95
0.85
0.75
0.15
0.05
Figure 27. 8-Lead Mini Small Outline Package [MSOP]
(RM-8)
Dimensions shown in millimeters