Datasheet

Data Sheet ADP5033
Rev. F | Page 25 of 28
OUTLINE DIMENSIONS
10-19-2012-B
A
B
C
D
0.660
0.600
0.540
SIDE VIEW
0.270
0.240
0.210
0.390
0.360
0.330
0.360
0.320
0.280
COPLANARITY
0.04
SE
ATING
PLANE
1
2
3
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIER
0.50
REF
1.50
REF
2.040
2.000 SQ
1.960
Figure 48. 16-Ball Wafer Level Chip Scale Package [WLCSP]
Back-Coating Included
(CB-16-8)
Dimensions shown in millimeters