Datasheet

Data Sheet ADP5034
Rev. E | Page 27 of 28
OUTLINE DIMENSIONS
0.50
BSC
0.50
0.40
0.30
0.30
0.25
0.20
COMPLIANT TO JEDEC STANDARDS MO-220-WGGD-8.
06-11-2012-A
BOTTOM VIEWTOP VIEW
EXPOSED
PAD
P
I
N
1
I
N
D
I
C
A
T
O
R
4.10
4.00 SQ
3.90
SEATING
PLANE
0.80
0.75
0.70
0.20 REF
0.25 MIN
COPLANARITY
0.08
PIN 1
INDICATOR
2.20
2.10 SQ
2.00
1
24
7
12
13
18
19
6
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
0.05 MAX
0.02 NOM
Figure 55. 24-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
4 mm × 4 mm Body, Very Very Thin Quad
(CP-24-10)
Dimensions shown in millimeters
COMPLIANT TO JEDEC STANDARDS MO-153-AET
28
15
14
1
EXPOSED
PAD
(Pins Up)
9.80
9.70
9.60
4.50
4.40
4.30
6.40
BSC
TOP VIEW
BOTTOM VIEW
0.65 BSC
0.15
0.05
COPLANARITY
0.10
1.20 MAX
1.05
1.00
0.80
0.30
0.19
SEATING
PLANE
0.20
0.09
3.05
3.00
2.95
8°
0°
0.75
0.60
0.45
3.55
3.50
3.45
02-23-2012-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 55. 28-Lead Thin Shrink Small Outline with Exposed Pad Package [TSSOP_EP]
9.7 mm × 6.4 mm Body, (RE-28-1)
Dimensions shown in millimeters