Datasheet

ADP5065 Data Sheet
Rev. D | Page 38 of 40
PACKAGING AND ORDERING INFORMATION
OUTLINE DIMENSIONS
A
B
C
D
E
2.75
2.71
2.67
2.08
2.04
2.00
1
23
4
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
BALL A1
IDENTIFIE
R
0.50
REF
0.660
0.600
0.540
SIDE VIEW
0.270
0.240
0.210
0.360
0.320
0.280
2.00 REF
1.50 REF
COPLANARITY
0.04
SEATING
PLANE
0.390
0.360
0.330
10-30-2012-A
Figure 42. 20-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-20-8)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range (Junction) Package Description Package Option
ADP5065ACBZ-1-R7 −40°C to +125°C 20-Ball Wafer Level Chip Scale Package [WLCSP] CB-20-8
ADP5065CB-EVALZ ADP5065 Evaluation Board
1
Z = RoHS Compliant Part.