Datasheet

Rev. D | Page 52 of 52 | May 2013
ADSP-21061/ADSP-21061L
©2013 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D00170-0-5/13(D)
SURFACE-MOUNT DESIGN
Table 34 is provided as an aide to PCB design. For industry-standard design recommendations, refer to IPC-7351, Generic Requirements
for Surface-Mount Design and Land Pattern Standard.
ORDERING GUIDE
Table 34. BGA Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
225-Ball Grid Array (PBGA) Solder Mask Defined 0.63 mm diameter 0.73 mm diameter
Model Notes
Temperature
Range
Instruction
Rate
On-Chip
SRAM
Operating
Voltage Package Description
Package
Option
ADSP-21061KS-133 0C to 85C 33 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061KSZ-133
1
1
Z = RoHS Compliant Part.
0C to 85C 33 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061KS-160 0C to 85C 40 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061KSZ-160
1
0C to 85C 40 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061KS-200 0C to 85C 50 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061KSZ-200
1
0C to 85C 50 MHz 1M Bit 5 V 240-Lead MQFP_ED SP-240-2
ADSP-21061LKB-160 0C to 85C 40 MHz 1M Bit 3.3 V 225-Ball PBGA B-225-2
ADSP-21061LKBZ-160
1
0C to 85C 40 MHz 1M Bit 3.3 V 225-Ball PBGA B-225-2
ADSP-21061LKSZ-160
1
0C to 85C 40 MHz 1M Bit 3.3 V 240-Lead MQFP S-240
ADSP-21061LASZ-176
1
–40C to +85C 44 MHz 1M Bit 3.3 V 240-Lead MQFP S-240
ADSP-21061LKSZ-176
1
0C to 85C 44 MHz 1M Bit 3.3 V 240-Lead MQFP S-240