Datasheet

Rev. G | Page 44 of 48 | December 2012
ADSP-21261/ADSP-21262/ADSP-21266
SURFACE-MOUNT DESIGN
Table 42 is provided as an aide to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface-Mount Design and Land Pattern
Standard.
Figure 36. 136-Ball Chip Scale Package Ball Grid Array [CSP_BGA]
(BC-136-1)
Dimensions shown in millimeters
*
COMPLIANT WITH JEDEC STANDARDS MO-205-AE
WITH EXCEPTION TO BALL DIAMETER.
0.25 MIN
DETAIL A
*
0.50
0.45
0.40
BALL DIAMETER
0.12 MAX
COPLANARITY
0.80 BSC
10.40
BSC SQ
A
B
C
D
E
F
G
H
J
K
L
M
12
13
14
11
10
8
7
6
3
2
1
95
4
1.31
1.21
1.10
A1 CORNER
INDEX AREA
1.70 MAX
TOP VIEW
BALL A1
INDICATOR
DETAIL A
BOTTOM VIEW
N
P
12.10
12.00 SQ
11.90
SEATING
PLANE
Table 42. BGA_ED Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
136-Ball CSP_BGA (BC-136-1) Solder Mask Defined (SMD) 0.4 mm 0.53 mm