Datasheet

ADSP-21371
PACKAGE INFORMATION
The information presented in Figure 2 provides details about
the package branding for the ADSP-21371 processor. For a
complete listing of product availability, see Ordering Guide on
Page 48.
vvvvvv.x n.n
tppZ-cc
S
ADSP-2137x
a
yyww country_of_origin
Figure 2. Typical Package Brand
Table 9. Package Brand Information
Brand Key
t Temperature Range
pp Package Type
Z RoHS Compliant Part
ccc See Ordering Guide
vvvvvv.x Assembly Lot Code
n.n Silicon Revision
yyww Date Code
Field Description
MAXIMUM POWER DISSIPATION
See Engineer-to-Engineer Note “Estimating Power Dissipation
for ADSP-2137x SHARC Processors” (EE-319) for detailed
thermal and power information regarding maximum power dis-
sipation. For information on package thermal specifications, see
Thermal Characteristics on Page 45.
ABSOLUTE MAXIMUM RATINGS
Stresses greater than those listed in Table 10 may cause perma-
nent damage to the device. These are stress ratings only;
functional operation of the device at these or any other condi-
tions greater than those indicated in the operational sections of
this specification is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device
reliability.
Table 10. Absolute Maximum Ratings
Parameter Rating
Internal (Core) Supply Voltage (V
DDINT
) –0.3 V to +1.5 V
External (I/O) Supply Voltage (V
DDEXT
) –0.3 V to +4.6 V
Input Voltage –0.5 V to V
DDEXT
+0.5 V
Output Voltage Swing –0.5 V to V
DDEXT
+0.5 V
Load Capacitance 200 pF
Storage Temperature Range –65°C to +150°C
Junction Temperature under Bias 125°C
ESD SENSITIVITY
ESD (electrostatic discharge) sensitive device.
Charged devices and circuit boards can discharge
without detection. Although this product features
patented or proprietary circuitry, damage may occur
on devices subjected to high energy ESD. Therefore,
proper ESD precautions should be take to avoid
performance degradation or loss of functionality.
Rev. 0 | Page 16 of 48 | June 2007