Datasheet

ADSP-21483/ADSP-21486/ADSP-21487/ADSP-21488/ADSP-21489
Rev. B | Page 17 of 68 | March 2013
CLK_CFG
1–0
I Core to CLKIN Ratio Control. These pins set the start up clock frequency.
Note that the operating frequency can be changed by programming the PLL multiplier
and divider in the PMCTL register at any time after the core comes out of reset. The
allowed values are:
00 = 8:1
01 = 32:1
10 = 16:1
11 = reserved
CLKIN I Local Clock In. Used in conjunction with XTAL. CLKIN is the clock input. It configures
the processors to use either its internal clock generator or an external clock source.
Connecting the necessary components to CLKIN and XTAL enables the internal clock
generator. Connecting the external clock to CLKIN while leaving XTAL unconnected
configures the processors to use the external clock source such as an external clock
oscillator. CLKIN may not be halted, changed, or operated below the specified
frequency.
XTAL O Crystal Oscillator Terminal. Used in conjunction with CLKIN to drive an external
crystal.
RESET
I Processor Reset. Resets the processor to a known state. Upon deassertion, there is a
4096 CLKIN cycle latency for the PLL to lock. After this time, the core begins program
execution from the hardware reset vector address. The RESET input must be asserted
(low) at power-up.
RESETOUT/
RUNRSTIN
I/O (ipu) Reset Out/Running Reset In. The default setting on this pin is reset out. This pin also
has a second function as RUNRSTIN which is enabled by setting bit 0 of the RUNRSTCTL
register. For more information, see the ADSP-214xx SHARC Processor Hardware Reference.
BOOT_CFG
2–0
I Boot Configuration Select. These pins select the boot mode for the processor (see
Table 9). The BOOT_CFG pins must be valid before RESET
(hardware and software) is
asserted.
1
The MLB pins are only available on the automotive models.
Table 12. Pin List, Power and Ground
Name Type Description
V
DD_INT
P Internal Power Supply
V
DD_EXT
P I/O Power Supply
GND
1
G Ground
V
DD_THD
P Thermal Diode Power Supply. When not used, this pin can be left floating.
1
The exposed pad is required to be electrically and thermally connected to GND. Implement this by soldering the exposed pad to a GND PCB land that is the same size as the
exposed pad. The GND PCB land should be robustly connected to the GND plane in the PCB for best electrical and thermal performance. No separate GND pins are provided
in the package.
Table 11. Pin Descriptions (Continued)
Name Type
State
During/
After Reset Description
The following symbols appear in the Type column of this table: A = asynchronous, I = input, O = output, S = synchronous, A/D = active drive,
O/D = open drain, and T = three-state, ipd = internal pull-down resistor, ipu = internal pull-up resistor.
The internal pull-up (ipu) and internal pull-down (ipd) resistors are designed to hold the internal path from the pins at the expected logic
levels. To pull-up or pull-down the external pads to the expected logic levels, use external resistors. Internal pull-up/pull-down resistors cannot
be enabled/disabled and the value of these resistors cannot be programmed. The range of an ipu resistor can be between 26 kΩ–63 kΩ. The
range of an ipd resistor can be between 31 kΩ–85kΩ. The three-state voltage of ipu pads will not reach to the full V
DD_EXT
level; at typical
conditions the voltage is in the range of 2.3 V to 2.7 V.
In this table, all pins are LVTTL compliant with the exception of the thermal diode pins.