Datasheet

ADSP-21483/ADSP-21486/ADSP-21487/ADSP-21488/ADSP-21489
Rev. B | Page 65 of 68 | March 2013
SURFACE-MOUNT DESIGN
The exposed pad is required to be electrically and thermally
connected to GND. Implement this by soldering the exposed
pad to a GND PCB land that is the same size as the exposed pad.
The GND PCB land should be robustly connected to the GND
plane in the PCB for best electrical and thermal performance.
No separate GND pins are provided in the package.
Figure 53. 176-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP
1
]
(SW-176-2)
Dimensions shown in millimeters
1
For information relating to the exposed pad on the SW-176-2 package, see the table endnote on Page 60.
COMPLIANT TO JEDEC STANDARDS MS-026-BGA-HD
0.15
0.10
0.05
0.08
COPLANARITY
0.20
0.15
0.09
1.45
1.40
1.35
7°
3.5°
0°
VIEW A
ROTATED 90° CCW
0.27
0.22
0.17
0.75
0.60
0.45
0.50
BSC
LEAD PITCH
24.10
24.00 SQ
23.90
26.20
26.00 SQ
25.80
TOP VIEW
(PINS DOWN)
BOTTOM VIEW
(PINS UP)
EXPOSED
PAD
1
44
1
44
45
89
88
45
88
132
89
132
176
133
176
133
PIN 1
1.60 MAX
1.00 REF
SEATING
PLANE
VIEW A
6.00
REF
21.50 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
“SURFACE-MOUNT DESIGN” IN
THIS DATA SHEET.