Datasheet

ADSP-BF531/ADSP-BF532/ADSP-BF533
Rev. I | Page 61 of 64 | August 2013
SURFACE-MOUNT DESIGN
Table 47 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351,
Generic Requirements for Surface-Mount Design and Land Pat-
tern Standard.
Table 47. BGA Data for Use with Surface-Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
Chip Scale Package Ball Grid Array (CSP_BGA) BC-160-2 Solder Mask Defined 0.40 mm diameter 0.55 mm diameter
Plastic Ball Grid Array (PBGA) B-169 Solder Mask Defined 0.43 mm diameter 0.56 mm diameter