Datasheet

ADuC7019/20/21/22/24/25/26/27/28/29 Data Sheet
Rev. F | Page 20 of 104
ABSOLUTE MAXIMUM RATINGS
AGND = REFGND = DACGND = GND
REF
, T
A
= 25°C, unless
otherwise noted.
Table 10.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Only one absolute maximum rating can be applied at any one time.
ESD CAUTION
Parameter Rating
AV
DD
to IOV
DD
−0.3 V to +0.3 V
AGND to DGND −0.3 V to +0.3 V
IOV
DD
to IOGND, AV
DD
to AGND −0.3 V to +6 V
Digital Input Voltage to IOGND −0.3 V to +5.3 V
Digital Output Voltage to IOGND −0.3 V to IOV
DD
+ 0.3 V
V
REF
to AGND
−0.3 V to AV
DD
+ 0.3 V
Analog Inputs to AGND −0.3 V to AV
DD
+ 0.3 V
Analog Outputs to AGND −0.3 V to AV
DD
+ 0.3 V
Operating Temperature Range, Industrial –40°C to +125°C
Storage Temperature Range –65°C to +150°C
Junction Temperature 150°C
θ
JA
Thermal Impedance
40-Lead LFCSP 26°C/W
49-Ball CSP_BGA 80°C/W
64-Lead LFCSP 24°C/W
64-Ball CSP_BGA 75°C/W
64-Lead LQFP 47°C/W
80-Lead LQFP 38°C/W
Peak Solder Reflow Temperature
SnPb Assemblies (10 sec to 30 sec) 240°C
RoHS Compliant Assemblies
(20 sec to 40 sec)
260°C