Datasheet

ADV3219/ADV3220
Rev. 0 | Page 18 of 20
OUTLINE DIMENSIONS
2.54
2.44
2.34
111809-A
TOP VIEW
8
1
5
4
0.30
0.25
0.20
BOTTOM VIEW
PIN 1 INDEX
AREA
SEATING
PLANE
0.80
0.75
0.70
1.80
1.70
1.60
0.203 REF
0.05 MAX
0.02 NOM
0.50 BSC
EXPOSED
PAD
3.10
3.00 SQ
2.90
P
I
N
1
I
N
D
I
C
A
T
O
R
(
R
0
.
1
5
)
FORPROPERCONNECTIONOF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COPLANARITY
0.08
0.50
0.40
0.30
COMPLIANT TO JEDEC STANDARDS MO-229-WEED
Figure 57. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-11)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option Branding Code
ADV3219ACPZ −40°C to +85°C 8-Lead LFCSP_WD CP-8-11 F0H
ADV3219ACPZ-RL −40°C to +85°C 8-Lead LFCSP_WD, 13” Tape and Reel CP-8-11 F0H
ADV3219ACPZ-R7 −40°C to +85°C 8-Lead LFCSP_WD, 7” Tape and Reel CP-8-11 F0H
ADV3220ACPZ −40°C to +85°C 8-Lead LFCSP_WD CP-8-11 F0J
ADV3220ACPZ-RL −40°C to +85°C 8-Lead LFCSP_WD, 13” Tape and Reel CP-8-11 F0J
ADV3220ACPZ-R7 −40°C to +85°C 8-Lead LFCSP_WD, 7” Tape and Reel CP-8-11 F0J
ADV3219-EVALZ Evaluation Board
ADV3220-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.