Datasheet

ADV7390/ADV7391/ADV7392/ADV7393 Data Sheet
Rev. G | Page 106 of 108
Figure 147. 40-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
6 mm × 6 mm Body, Very Thin Quad
(CP-40-1)
Dimensions shown in millimeters
Figure 148. 30-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-30-3)
Dimensions shown in millimeters
1
40
10
11
31
30
21
20
COMPLIANT TO JEDEC STANDARDS MO-220-VJJD-2
06-01-2012-D
0.50
BSC
PIN 1
INDICATOR
4.50 REF
0.20 MIN
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
4.25
4.10 SQ
3.95
0.60 MAX
0.60 MAX
PIN 1
INDICATOR
6.10
6.00 SQ
5.90
5.85
5.75 SQ
5.65
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
EXPOSED
PAD
(BOTTOM VIEW)
A
B
C
D
E
F
0.660
0.600
0.540
2.565
2.525
2.485
1
2
3
45
BOTTOM VIEW
(BALL SIDE UP)
TOP VIEW
(BALL SIDE DOWN)
SIDE VIEW
0.270
0.240
0.210
0.390
0.360
0.330
0.360
0.320
0.280
2.50
REF
2.00 REF
BALL A1
IDENTIFIER
COPLANARITY
0.05
SEATING
PLANE
3.045
3.005
2.965
0.50
BALL PITCH
10-31-2012-C