Datasheet

REV. B
OP90
–5–
ORDERING GUIDE
Package Options
T
A
= 25C Operating
V
OS
Max CERDIP Plastic Temperature
(mV) 8-Lead 8-Lead Range
150 OP90AZ/883* MIL
150 OP90EZ* IND
450 OP90GP XIND
450 OP90GS XIND
*Not for new design, obsolete April 2002.
ABSOLUTE MAXIMUM RATINGS
1
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±18 V
Differential Input Voltage . . . . [(V–) – 20 V] to [(V+) + 20 V]
Common-Mode Input Voltage . . . . . . . . . . . . . . . . . . . . . . . .
. . . . . . . . . . . . . . . . . . . . . . . . [(V–) – 20 V] to [(V+) + 20 V]
Output Short-Circuit Duration . . . . . . . . . . . . . . . . Indefinite
Storage Temperature Range
Z Package . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
P Package . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to +150°C
Operating Temperature Range
OP90A . . . . . . . . . . . . . . . . . . . . . . . . . . . –55°C to +125°C
OP90E . . . . . . . . . . . . . . . . . . . . . . . . . . . . –25°C to +85°C
OP90G . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to +85°C
Junction Temperature (T
J
) . . . . . . . . . . . . . –65°C to +150°C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . . 300°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the OP90 features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Package Type
JA
2
JC
Unit
8-Lead Hermetic DIP (Z) 148 16 °C/W
8-Lead Plastic DIP (P) 103 43 °C/W
8-Lead SO (S) 158 43 °C/W
NOTES
1
Absolute Maximum Ratings apply to packaged parts, unless otherwise noted.
2
JA
is specified for worst-case mounting conditions; i.e.,
JA
is specified for
device in socket for CerDIP, and P-DIP;
JA
is specified for devices soldered to
printed circuit board for SO package.