Datasheet

REF01
Rev. H | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
1
Input Voltage 40 V
Output Short-Circuit Duration
(to Ground or V
IN
) Indefinite
Storage Temperature Range
J, S, and Z Packages −65°C to +150°C
P Package −65°C to +125°C
Operating Temperature Range
REF01A −55°C to +125°C
REF01CJ 0°C to 70°C
REF01CP, REF01CS, REF01E, REF01H −40°C to +85°C
Junction Temperature (T
J
) −65°C to +150°C
Lead Temperature (Soldering @ 60 sec) 300°C
1
Absolute maximum ratings apply to both DICE and packaged parts, unless
otherwise noted.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
Table 6.
Package Type θ
JA
1
θ
JC
Unit
TO-99 (J) 170 24 °C/W
8-Lead CERDIP (Z) 162 26 °C/W
8-Lead PDIP (P) 110 50 °C/W
8-Pin SOIC (S) 160 44 °C/W
1
θ
JA
is specified for worst-case mounting conditions; that is, θ
JA
is specified for
device in socket for TO, CERDIP, and PDIP packages. θ
JA
is specified for device
soldered to printed circuit board for SOIC package.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.