Datasheet

SSM2211 Data Sheet
Rev. G | Page 6 of 24
ABSOLUTE MAXIMUM RATINGS
Absolute maximum ratings apply at T
A
= 25°C, unless
otherwise noted.
Table 4.
Parameter Rating
Supply Voltage 6 V
Input Voltage V
DD
Common-Mode Input Voltage V
DD
ESD Susceptibility 2000 V
Storage Temperature Range −65°C to +150°C
Operating Temperature Range −40°C to +85°C
Junction Temperature Range −65°C to +165°C
Lead Temperature, Soldering (60 sec) 300°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 5. Thermal Resistance
Package Type θ
JA
θ
JC
Unit
8-Lead LFCSP (CP-Suffix)
1
50 75 °C/W
8-Lead SOIC_N (S-Suffix)
2
121
43
°C/W
1
For the LFCSP, θ
JA
is measured with exposed lead frame soldered to the PCB.
2
For the SOIC_N, θ
JA
is measured with the device soldered to a 4-layer PCB.
ESD CAUTION