Datasheet

Data Sheet SSM2603
Rev. C | Page 31 of 32
OUTLINE DIMENSIONS
Figure 32. 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
5 x 5 mm Body, Very Very Thin Quad
(CP-28-6)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
SSM2603CPZ-REEL −40°C to +85°C 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-28-6
SSM2603CPZ-REEL7 −40°C to +85°C 28-Lead Lead Frame Chip Scale Package [LFCSP_WQ] CP-28-6
SSM2603-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.
1
0.50
BSC
BOTTOM VIEWTOP VIEW
28
8
14
15
21
22
7
EXPOSED
PAD
PIN 1
INDICATOR
3.40
3.30 SQ
3.20
0.50
0.40
0.30
SEATING
PLANE
0.80
0.75
0.70
0.05 MAX
0.02 NOM
0.203 REF
COPLANARITY
0.08
PIN 1
INDICATOR
0.30
0.25
0.18
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-3.
5.10
5.00 SQ
4.90
05-23-2012-B
0.20 MIN