Datasheet

SSM2604 Data Sheet
Rev. A | Page 26 of 28
OUTLINE DIMENSIONS
2.65
2.50 SQ
2.35
3.75
BSC SQ
COMPLIANT
TO JEDEC STANDARDS MO-220-VGGD-1
1
0.50
BSC
PIN 1
INDICATOR
0.50
0.40
0.30
TOP VIEW
12° MAX
0.80 MAX
0.65 TYP
SEATING
PLANE
PIN 1
INDICATOR
COPLANARITY
0.08
1.00
0.85
0.80
0.30
0.23
0.18
0.05 MAX
0.02 NOM
0.20 REF
20
6
16
10
11
15
5
0.60 MAX
0.60 MAX
0.25 MIN
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
04-09-2012-B
4.10
4.00 SQ
3.90
EXPOSED
PAD
BOTTOM VIEW
Figure 28. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
4 mm × 4 mm Body, Very Thin Quad
(CP-20-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
1
Temperature Range Package Description Package Option
SSM2604CPZ-REEL −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-4
SSM2604CPZ-REEL7 −40°C to +85°C 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ] CP-20-4
SSM2604-EVALZ Evaluation Board
1
Z = RoHS Compliant Part.