- Analog Devices, Inc. Embedded Processor Specification Sheet

ADSP-TS201S
Rev. C | Page 45 of 48 | December 2006
OUTLINE DIMENSIONS
The ADSP-TS201S processor is available in a 25 mm × 25 mm,
576-ball metric thermally enhanced ball grid array (BGA_ED)
package with 24 rows of balls (BP-576).
SURFACE MOUNT DESIGN
Table 36 is provided as an aid to PCB design. For industry-
standard design recommendations, refer to IPC-7351, Generic
Requirements for Surface Mount Design and Land Pattern
Standard.
Figure 47. 576-Ball BGA_ED (BP-576)
1.00
BSC
(BALL
PITCH)
0.75
0.65
0.55
(BALL
DIAMETER)
DETA IL A
NOTES:
1. ALL DIMENS ION S A RE IN M ILLIM ETERS.
2. THE ACTUAL POS ITION O F THE BALL GR ID IS WITHIN 0.25 m m OF ITS
IDE AL POS ITION RE LATIV E TO TH E PACKAGE E DGE S.
3. CENTER DIMENSIONS ARE N OMINAL.
4. THIS PACKAG E C ONFORMS TO JEDEC M S-034 SPECIFICATION.
SEATING PLANE
1.60 MAX
0.20 MAX
DETAIL A
0.97 BSC
79531
1113
15
1721 1923
68
10121416182024 22
42
R
P
N
M
L
K
J
H
G
F
E
D
C
B
A
Y
W
V
U
T
AD
AC
AB
AA
23.00
BSC
SQ
25.20
25.00
24.80
25.20
25.00
24.80
TOP VIEW
BOT TOM VIEW
1.00
BSC
0.60
0.50
0.40
1.00
BSC
A1 BALL
INDICATOR
1.25
1.00
0.75
1.25
1.00
0.75
3.10
2.94
2.78
Table 36. BGA Data for Use with Surface Mount Design
Package Ball Attach Type Solder Mask Opening Ball Pad Size
576-Ball BGA_ED
(BP-576)
Nonsolder Mask Defined (NSMD) 0.69 mm diameter 0.56 mm diameter