Specifications

Train Board for Solder and Lead Inspection
If the user wants to perform solder inspection on the board he/she is going to
train, they should try to obtain package information for the Devices and list
them in the CXF file. Package information is helpful during updates of solder
and lead parameters. Training the Device labels first without concerning lead
and solder areas is recommended. Be sure each Device has a Device number
assigned to it. The lead and solder areas can be added later. Because
position accuracy is critical for solder and lead inspection, the user must take
the time to position the three reference Devices as accurately as possible at
the beginning of CAD import. If good positions are established from the
beginning, the user won't have to do much "tweaking" in the form of Step
Through later.
To get started, here are the steps for add lead and solder areas:
A. For leaded ICs
1. First check the Device outline by selecting Move, Device Outline from the
Device menu, adjust if necessary.
2. Train lead area by selecting Train, Lead from the Device menu. Define the
size of the lead area. The recommended algorithm for lead inspection is
No11.
3. Set Extended parameters such as pitch, and tolerances for the leads.
4. Do a Test Lead Area to verify lead parameter.
5. Repeat step 1 until all the lead area is defined.
6. Use the Align... from the lead mean is necessary to fine tune the lead area
position and size.
7. Train solder areas by selecting Train Solder Area from the lead menu.
8. Pull down the solder menu, select Edit Parameters.., and specify the
direction of the solder area relative to the Device. Select the Image
number, and then select algorithm number. The recommended number is
2.
9. From the solder menu select Extended Params, set the parameters
accordingly. The recommended parameters are pass 65% white, 1st
threshold 0 and 2nd threshold 128.
10. From the solder menu select Update Solder.
11. Repeat step 4 to 7 until solder areas in all the lead area is defined.
12. Use the Align... function from the Solder menu to fine tune the position
and size of the solder areas.
13. From the Device menu, select Update Library, select Update Package,
and answer Yes to the question
"Do you want to update other instances of the Device in the Device list
B. For Chip devices
1. First check the Device outline by selecting Move, Device Outline from the
Device menu, adjust if necessary.
2. Train solder area by select Train, Solder from the Device menu.
3. Pull down the solder menu, select Edit Parameters.., and specify the