Specifications

Auto Re-Test Failed Devices
If enabled, at the end of the inspection process the system will re-visit the
Devices that failed and re-test them. This reduces the false failure caused by
vibration of the system. This option can also be turned on or off in the Result
dialog.
Print Defect Map in Report
If enabled, a defect map will append to the inspection report.
Optional Biscuit Skip (X Out)
In a biscuit board, one or more biscuits may be unpopulated (X Out). With this
option enabled, the system skips the unpopulated areas. This option works
differently for off-line systems than for in-line systems.
For off-line systems, when this option is enabled, the user is allowed to
interactively select the biscuit or biscuits needed to be skipped from the map
view every time a new board is loaded in.
For in-line systems, the user will check the by label box. This instructs the
system to search for a marker for the biscuit. If the marker is there, the biscuit
will be inspected. A biscuit marker can be trained by training a Device with a
Ref.ID of xx-BLKTAG. For example, the biscuit label for biscuit 1 would be 01-
BLKTAG. To skip a biscuit, the user may place a label to cover its biscuit
marker.
Enable Bar Code Reader
Enable/Disable the integrated bar code reader. Refer to Barcode Reader
section.
SMEMA Conveyor Intf.
Enable/Disable the SMEMA compatible conveyor interface. Refer to SMEMA
Conveyor Interface section.
Device Inspection
[Enable Colour]
Enable/Disable the device inspection from the “Board
Program”.Enable/Disable the colour test on devices. If the device test is
disabled the “Enable Colour” check box will be disabled automatically.
Solder Inspection
Enable/Disable the Solder inspection from the “Board Program”.
Lead Inspection
Enable/Disable the Lead inspection from the “Board Program”.