Specifications

Package Library
A package defines the position of the solder and lead area. Common
packages for passive devices are 0805, 0602, 1206 etc. For active devices
package name such as PLCC, SOIC and QFP are common. In the software
Device update can either go through Part Number or through Device package.
Since the information for lead and solder areas are the same for the same
package, having a package library is a convenient way to update solder and
lead area.
There are three ways to enter the package information into Board Setups.
1. From CAD data when training the board.
This is the most straight forward way of incorporating package info into the
Board Setup.
2. Import a Part Number to package listing.
Sometime package info for Device is not available from CAD data. User
must create a list correlating Part number with package type. Here is an
example of such list:
.PKG_NAME_EXCHANGE
P/N Package
240756 0603R
240739 0603R
240740 0603R
240741 0805R
240742 0805R
240743 0805R
240744 1206R
240745 1206R
240746 0603C
240748 0805C
240749 1206C
240750 CC-TAN
240751 SOT23
240752 DO-214
240753 50SOIC14
240754 50SOIC20
240755 25QFP132
.DATA_END
The software can import such a list and assign package info to all the Part
Numbers listed. To import select Import Package Name from the Package
Library pop up menu.
3. Interactively enter the package type to each library Device.
User can also interactively enter the package info into each Part Number
(or a range of Part Numbers). To do so first select the Device or Devices in
the Device Library (multiple selection can be make with the use of Shift or
Ctrl key), then select Edit Active Devices... from the pop up menu, the
following dialog will display: