Datasheet
Low profile
• The lowest case available in 2, 4, 6 and 8 pole versions
• Reduction of the shadow effect in IR soldering
• 30 % reduction of component volume
Two versions
Surface mount models
• Designed for reflow soldering
• UL 94-V0 high temperature materials
• Tin plated terminals
Through-hole models
• Same thermal specifications as SMT models, allowing mixed
soldering process
Washable by construction
• Moulded-in terminals
• Ultrasonic-welded case
• Two slots on case corners allowing removal of
protection tape
Reliable contacts
• Anti-crush system on moving contact
• Bifurcated self-cleaning sliding contacts
• Positive detent actuation
• Recessed slide actuators preventing accidental actuation
• Good visibility of actuators : black slide on clear background
Two types of packaging
Surface mount models
• Tape and reel (1.000 pieces per reel) - IC tubes
Through-hole models
• IC tubes
F-12 APEM www.apem.com
IKN series
DIP switches, surface mount or through-hole
F
Distinctive features
Dimensions : first dimensions are in mm while inches are shown as bracketted numbers.
UG1006-A