User Guide
Table Of Contents
- Mac Pro (8x)
- Contents
- Basics
- Take Apart
- General Information
- Opening the Computer
- Hard Drives
- Optical Drive Carrier and Optical Drives
- Memory (FB-DIMMs) and Memory Riser Cards
- PCI Express/Graphics Card
- Power Supply
- Power Supply Fan
- AirPort Extreme Card
- Bluetooth Card
- Battery
- Processor Heatsink Cover
- Front Fan Assembly
- Mac Pro RAID Card and Battery
- Memory Cage with Rear Fan
- Processor Heatsinks
- Processors
- Speaker Assembly
- USB Cable
- Logic Board
- Front Panel Board
- Power Button
- AirPort Antenna Board with Cables
- Optical Drive Power Cable
- Optical Drive Data (Ribbon) Cable
- Ambient Board
- Ambient Board Cable
- Bluetooth Antenna Board and Cable
- Hard Drive Cable Harness
- Hard Drive Temperature Sensor Cable
- Hard Drive Temperature Sensor
- Power Cable Harness
- Troubleshooting
- Upgrades
- Views

Mac Pro (8x) Basics 10
Special Handling Instructions
The Mac Pro (8x) conguration uses a special coating on the processor heatsink and processor
to manage the temperature in the computer. To ensure proper handling and disposal of this
material, please read the following information.
Handling Instructions
Use these guidelines when handling the Mac Pro (8x) processor heatsink and processor:
General
Wear disposable nitrile or latex gloves when handling the processor heatsink and processor.•
Avoid touching the silver coating on the underside of the heatsink and the top of the •
processor.
Use care when removing the heatsink from the computer. As much as possible, lift the •
heatsink straight up o the processor.
Use care when removing the processor from the logic board. Lift the processor out of the •
processor holder by inserting a nger or atblade screwdriver in the notch at the front of the
holder. Hold the processor only by the edges.
When installing a replacement heatsink or processor, remove the protective cover from •
the new heatsink or processor and transfer it to the defective heatsink or processor before
packaging it for return to Apple.
Timing
When removing or replacing the heatsink and/or processor, do not allow the heatsink to be •
separated from the processor for more than 30 minutes. The silver coating on the heatsink
and processor degrades with exposure to air; more than 30 minutes exposure could result
in damage to the computer and a repeat, multi-part repair. Reassemble the computer while
waiting for any new parts to arrive.
When installing a new logic board, use care in transferring the heatsinks and processors to •
the new board. Do not allow the heatsinks and processors to be separated from the board
or from each other for more than 30 minutes. Reassemble the computer while waiting for a
new logic board to arrive.
Visual Inspection
Always make a visual inspection of a new processor or heatsink before installing it in the •
computer.
Always make a visual inspection of both existing processors and heatsinks before •
transferring them to a new logic board.
See “• Processor Heatsink and Processor Visual Inspection Instructions” in the
Troubleshooting chapter for more information.