Specifications

AirPrime Embedded Module Hardware Integration Guide
22 Proprietary and Confidential 2130114
Temperature monitoring state machine
Figure 2-3 illustrates the state machine used to monitor the embedded module’s
temperature, and Ta b l e 2 -2 details the temperature conditions that trigger state
changes.
Figure 2-3: Temperature monitoring state machine
State change: Normal mode to Low Power mode
This state change causes the module to suspend RF activity. It occurs when the
module temperature exceeds either the high (TEMP_HI_CRIT) or low
(TEMP_LO_CRIT) limits detailed in Tabl e 2 - 2.
Table 2-2: Temperature trigger levels
a
a. Module-reported temperatures at the printed circuit board. Temperature
decreases from 10°C–18°C between the PCB and the module shield,
and a further 10°C–18°C between the shield and host environment
(ambient), depending on the efficiency of heat-dissipation in the host
device.
Condition
MC57xx
Temp (°C)
MC8xxx
Temp (°C)
TEMP_LO_CRIT -30 -25
TEMP_NORM_LO -20 -15
TEMP_HI_NORM 85 85
TEMP_HI_WARN 95 95
TEMP_HI_CRIT 108 108
Normal
mode
High Temperature
Critical
(Low power mode)
High Temperature
Warning
Low Temperature
Critical
(Low power mode)
current_temp <= TEMP_HI_NORM
current_temp > TEMP_HI_WARN
current_temp < TEMP_HI_NORM
Host asserts
W_Disable#
Host asserts
W_Disable#
current_temp
> TEMP_HI_CRIT
current_temp < TEMP_LO_CRIT
current_temp > TEMP_NORM_LO
Power off.
Handled by
Power State
state machine.