Specifications

AirPrime Embedded Module Hardware Integration Guide
68 Proprietary and Confidential 2130114
EMI/ESD
Investigate sources of localized interference early in the design
cycle.
Methods to mitigate decreased
Rx performance on page 43
Provide ESD protection for the USIM connector at the exposed
contact point (in particular, the CLK, VCC, IO, and RESET lines).
USIM operation on page 61
Keep very low capacitance traces on the XIM_DATA and
XIM_CLK signals.
To minimize noise leakage, establish a very good ground
connection between the module and host.
Ground connection on page 40
Route cables away from noise sources (for example, power
supplies, LCD assemblies, etc.).
Methods to mitigate decreased
Rx performance on page 43
Shield high RF-emitting components of the host device (for
example, main processor, parallel bus, etc.).
Methods to mitigate decreased
Rx performance on page 43
Use discrete filtering on low frequency lines to filter out unwanted
high-order harmonic energy.
Methods to mitigate decreased
Rx performance on page 43
Use multi-layer PCBs to form shielding layers around high-speed
clock traces.
Methods to mitigate decreased
Rx performance on page 43
Thermal
Test to worst case operating conditions—temperature, voltage,
and operation mode (transmitter on 100% duty cycle, maximum
power).
Thermal Considerations on
page 65
Use appropriate techniques to reduce module temperatures (for
example, airflow, heat sinks, heat-relief tape, module placement,
etc.).
Thermal Considerations on
page 65
Host/Modem communication
Make sure the host USB driver supports remote wakeup,
resume, and suspend operations, and serial port emulation.
USB handshaking on page 57
When no valid data is being sent, do not send SOF tokens from
the host (causes unnecessary power consumption).
USB handshaking on page 57
Table 7-1: Hardware integration design considerations (Continued)
Suggestion Section where discussed