Developer Note Macintosh PowerBook 3400 Computer Macintosh PowerBook 3400c/180 Macintosh PowerBook 3400ce/200 Developer Note Launch Draft APPLE CONFIDENTIAL 4/18/00 Developer Technology Services © Apple Computer, Inc.
Apple Computer, Inc. © 1996 Apple Computer, Inc. All rights reserved. No part of this publication may be reproduced, stored in a retrieval system, or transmitted, in any form or by any means, mechanical, electronic, photocopying, recording, or otherwise, without prior written permission of Apple Computer, Inc., except to make a backup copy of any documentation provided on CD-ROM. Printed in the United States of America. The Apple logo is a trademark of Apple Computer, Inc.
Contents Figures and Tables Preface vii About This Developer Note Contents of This Note ix Supplemental Reference Documents Apple Publications x Other Publications xi Conventions and Abbreviations xi Typographical Conventions xi Standard Abbreviations xii Chapter 1 Introduction ix x 1 Features 2 Appearance 4 Configurations 5 Peripheral Devices 6 Compatibility Issues 6 Internal PCI Bus 6 Enhanced Trackpad 6 Open Transport 6 PC Card Software 7 Chapter 2 Architecture 9 Processor Bus 10 Main Process
Power Management Unit 15 Display Controller IC 16 PC Card Bridge IC 16 Chapter 3 I/O Features 17 Internal ATA Hard Disk Drive 18 Hard Disk Specifications 18 Hard Disk Connector 19 Signal Assignments 20 ATA Signal Descriptions 21 Trackpad 22 Keyboard 22 Flat Panel Display 23 External Video Monitor 24 Monitors Supported 24 Video Connector 25 Video Adapter 26 Monitor Sense Codes 26 Serial Port 27 SCSI Port 28 ADB Port 29 Infrared Communication Link 30 Sound System 31 Sound Inputs 31 Built-in Microphone 32
Expansion Card Design 39 Connectors on the Expansion Card 39 Card Dimensions 43 Component Height Limits 45 Thermal Considerations for the Expansion Card 47 Power Budget for the Expansion Card 48 Expansion Card Operation and Sleep Mode 49 Power Saving Considerations 51 Power Sequences 51 Expansion Bay 53 Expansion Bay Module 54 Datum Slot 54 Maximum Dimensions 56 Location of the Circuit Board and Connectors 57 Grounding the Module 62 Mechanical Support Areas 64 Expansion Bay Connector 65 PCI Signals on the E
Chapter 5 Software Features 89 Internal System ROM 90 Power Management Unit ROM Battery Charging 91 Interface to Nonvolatile RAM BootPowerPC ROM 92 OpenFirmware ROM 92 Macintosh System ROM 92 ATA Manager and Driver 92 Floppy Disk Driver 93 IRTalk Driver 93 Expansion Bay Manager 93 PC Card Manager 94 SCSI Disk Mode 94 Sound Manager 94 Video Driver 94 Glossary Index 91 91 97 99 vi Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
Figures and Tables Chapter 1 Chapter 2 Chapter 3 Chapter 4 Introduction 1 Figure 1-1 Figure 1-2 Front view of the computer Back view of the computer Table 1-1 Configurations Architecture 9 Figure 2-1 Block diagram I/O Features 17 Figure 3-1 Figure 3-2 Figure 3-3 Figure 3-4 Figure 3-5 Figure 3-6 Figure 3-7 Maximum dimensions of the internal ATA hard disk Connector for the internal ATA hard disk 20 Keyboard, United States layout 23 Keyboard, ISO layout 23 Signal pins on the video connector 2
Figure 4-11 Figure 4-12 Figure 4-13 Figure 4-14 Figure 4-15 Figure 4-16 Figure 4-17 Figure 4-18 Figure 4-19 Figure 4-20 Figure 4-21 Figure 4-22 Figure 4-23 Figure 4-24 Figure 4-25 Figure 4-26 Figure 4-27 Figure 4-28 Figure 4-29 Figure 4-30 Figure 4-31 Figure 4-32 Figure 4-33 Figure 4-34 Heatsink for the PCI expansion card 48 PCI peripheral in sleep mode, interface unswitched 49 PCI peripheral in sleep mode, interface switched 50 Timing of the expansion card control signals for sleep mode 51 Front view of e
P R E F A C E About This Developer Note This developer note is a concise description of the Macintosh PowerBook 3400 computer, with the emphasis on the features that are new or different from those of the Macintosh PowerBook 5300 computer. This developer note is intended to help hardware and software developers design products that are compatible with the Macintosh products described in the note.
P R E F A C E Supplemental Reference Documents 0 The following documents provide information that complements or extends the information in this developer note. Apple Publications 0 For information about the PCI bus as it is supported on Macintosh desktop computers, developers should refer to Designing PCI Cards and Drivers for Power Macintosh Computers and to Macintosh Technote Number 1008, Understanding PCI Bus Performance.
P R E F A C E Other Publications 0 For information about programming the PowerPC™ family microprocessors, developers should have copies of Motorola’s PowerPC 603 RISC Microprocessor User’s Manual and PowerPC 603ev Microprocessor Implementation Definition Book IV. For information about ATA devices such as the built-in IDE hard disk, developers should have access to the ATA/IDE specification, ANSI proposal X3T10/0948D, Revision 2K or later (ATA-2).
P R E F A C E IMPORTANT A note like this contains important information that you should read before proceeding. ▲ ▲ W AR N I N G Warnings like this direct your attention to something that could cause injury to the user, damage to either hardware or software, or loss of data.
P R E F A C E CIS card information structure CLUT color lookup table CMOS complementary metal oxide semiconductor CPU central processing unit DAA data access adapter (a telephone line interface) DAC digital-to-analog converter DC direct current DCE device control entry (a data structure) DDC display data channel DDM driver descriptor map DMA direct memory access DMF distribution media format DOS disk operating system DRAM dynamic RAM DSP digital signal processor EDO extended
P R E F A C E PWM pulse width modulation RAM random-access memory RAMDAC random-access memory, digital to analog converter RAS row address strobe RGB red-green-blue (a type of color video system) RISC reduced instruction set computing rms root-mean-square ROM read-only memory SCC Serial Communications Controller SCSI Small Computer System Interface SNR signal-to-noise ratio SOJ small outline J-lead package SOP small outline package SVGA super video graphics adapter TDM time div
C H A P T E R Figure 1-0 Listing 1-0 Table 1-0 1 Introduction Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 1 Introduction The Macintosh PowerBook 3400 computer is an all-in-one notebook computer with several new features that greatly increase its performance. The PowerBook 3400 computer also has a PC Card slot, a PCI expansion slot, an improved expansion bay, a CD-ROM module, and a larger display. Features 1 Here is a list of the features of the Macintosh PowerBook 3400 computer. Each feature is described in a later chapter, as indicated in the list.
C H A P T E R 1 Introduction ■ Expansion bay: The computer has an opening that accepts a plug-in module with either a 5.25-inch CD-ROM drive, a 1.4-MB DOS-compatible floppy-disk drive, some other IDE storage device, or a power device such as an AC adapter. The expansion bay accepts expansion modules that use the PCI expansion bus; it can also accept the 3.5-inch expansion modules designed for the PowerBook 5300 and 190 computers. See “Expansion Bay” beginning on page 53.
C H A P T E R 1 Introduction Appearance 1 The Macintosh PowerBook 3400 computer has a streamlined case that opens up like a clamshell. The case is a new design with more flexibility than earlier PowerBook models. Figure 1-1 shows a front view of the computer; Figure 1-2 shows a back view.
C H A P T E R 1 Introduction Figure 1-2 Back view of the computer Sound input port Sound output port Two PC card (PCMCIA card) slots Infrared window PC card eject buttons Expansion port Apple Desktop Bus (ADB) port Reset button Elevation foot release button Printer/external modem port SCSI port (HDI-30) Video port Elevation feet Power adapter port Configurations 1 Table 1-1 lists the configurations of the PowerBook 3400 computer. All configurations include 16 MB of RAM and a 12.
C H A P T E R 1 Introduction Peripheral Devices 1 In addition to the devices that are included with the PowerBook 3400 computer, several peripheral devices are available separately: ■ The Macintosh PowerBook 16 MB Memory Expansion Card expands the RAM in the computer to 32 MB. ■ The Macintosh PowerBook 6x-speed CD-ROM drive module, which fits into the expansion bay, is available separately for models that do not include it.
C H A P T E R 1 Introduction Note The new TCP/IP control panel supports Open Transport; the older MacTCP control panel does not. ◆ PC Card Software 1 The PowerBook 3400 computer comes with a new version of the PC Card software. See “PC Card Software” on page 87. Compatibility Issues Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 1 Introduction 8 Compatibility Issues Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R Figure 2-0 Listing 2-0 Table 2-0 2 Architecture Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 2 Architecture The architecture of the Macintosh PowerBook 3400 computer is designed around two main buses: the processor bus and the PCI bus. The processor bus operates at 40 MHz, a submultiple of the microprocessor’s clock speed. The PCI bus operates at 33 MHz. An Apple custom IC called the PSX IC acts as the bridge between the two buses. The input and output devices are connected by way of the PCI bus. The block diagram in Figure 2-1 shows how the devices are connected to the buses.
C H A P T E R 2 Architecture Figure 2-1 Block diagram Processor/memory subsystem Input/output subsystem ADB port PowerPC 603ev microprocessor L2 cache PMU power manager IC SRAM Trackpad Keyboard Power Address Sound in AWAC sound IC ROM Data Sound out O'Hare RAM expansion card PSX memory controller and PCI bus bridge RAM Video/display subsystem SCSI Buffer Internal IDE hard disk PCI bus Expansion bay Buffer Video DRAM 65550 Flat panel display Serial port Port B [IR] I/O and disk
C H A P T E R 2 Architecture An optional RAM expansion card plugs into a 120-pin connector on the logic board. The RAM expansion card can contain up to 128 MB of RAM for a total of up to 144 MB of RAM. See the section “RAM Expansion” beginning on page 76 for details. Note The RAM expansion card for the PowerBook 3400 computer is a new design. The RAM expansion cards used in earlier PowerBook models will not work in the PowerBook 3400. ◆ The memory data bus (part of the processor bus) is 64 bits wide.
C H A P T E R 2 Architecture The PCI bus bridge generates PCI parity as required by the PCI bus specification, but it does not check parity or respond to the parity error signal. Big-Endian and Little-Endian Bus Addressing 2 Byte order for addressing on the processor bus is big endian and byte order on the PCI bus is little endian. The bus bridge performs the appropriate byte swapping and address transformations to translate between the two addressing conventions.
C H A P T E R 2 Architecture PCI Bus 2 The PCI bus connects the following devices: ■ the PSX IC that provides the bridge to the processor bus, already described ■ the O’Hare peripheral support IC ■ the display controller IC (Chips and Technologies 65550) ■ the PCI to PC Card bridge IC (TI 1130) that controls the PC Card sockets The PCI bus also connects to the internal expansion slot and the expansion bay.
C H A P T E R 2 Architecture ■ AWAC sound amplifier and codec IC ■ ATA and floppy disk devices in the expansion bay The O’Hare IC controls the power to the expansion bay and the signals that allow the user to insert a device into the expansion bay while the computer is operating. Those signals are fully described in the section “Expansion Bay” beginning on page 53. The O’Hare IC controls the interface for both the internal ATA hard disk drive and a possible second ATA drive in the expansion bay.
C H A P T E R 2 Architecture ■ controls clock signals to the other ICs ■ supports the ADB ■ scans the keyboard ■ controls display brightness ■ monitors battery charge level ■ controls battery charging Display Controller IC 2 The Chips and Technologies 65550 IC controls both the flat panel display and the external video monitor. It is set up to address 1 MB of video RAM.
C H A P T E R Figure 3-0 Listing 3-0 Table 3-0 3 I/O Features Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 3 I/O Features This chapter describes both the built-in I/O devices and the interfaces for external I/O devices. It also contains descriptions of the Ethernet cards installed in the PCI expansion slot in some configurations.
C H A P T E R 3 I/O Features Figure 3-1 Maximum dimensions of the internal ATA hard disk 19.25 maximum [0.757 maximum] 3.00 [0.118] 14.00 [0.403] 34.93±0.38 [1.375±0.015] 90.60 [3.567] 38.10 [1.500] 101.60 maximum [4.00 maximum] 4.06 [0.160] 61.72 [2.430] 70.00 [2.755] M3, 3.5 deep, minimum full thread, 16X Note: Dimensions are in millimeters [inches]. Hard Disk Connector 3 The internal hard disk has a 48-pin connector that carries both the ATA signals and the power for the drive.
C H A P T E R 3 I/O Features Figure 3-2 Connector for the internal ATA hard disk Key: vacant position at pin 20 Pin 1 3.99 [0.157] 19.25 maximum [0.757 maximum] Vacant row in 50-pin connector 10.14±0.375 [0.399±0.014] Center line of pin 44 Note: Dimensions are in millimeters [inches]. Signal Assignments 3 Table 3-1 shows the signal assignments on the 44-pin portion of the hard disk connector. A slash (/) at the beginning of a signal name indicates an active-low signal.
C H A P T E R 3 I/O Features Table 3-1 Pin assignments on the ATA hard disk connector (continued) Pin number Signal name Pin number Signal name 31 INTRQ 32 /IOCS16 33 DA1 34 /PDIAG 35 DA0 36 DA2 37 /CS0 38 /CS1 39 /DASP 40 GROUND 41 +5V LOGIC 42 +5V LOGIC 43 GROUND 44 Reserved NOTE CSEL, /DASP, /IOCS16, and /PDIAG are not used; see Table 3-2 ATA Signal Descriptions 3 Table 3-2 describes the signals on the ATA hard disk connector.
C H A P T E R 3 I/O Features Table 3-2 Signals on the ATA hard disk connector (continued) Signal name Signal description /DMACK Used by the host to initiate a DMA transfer in response to DMARQ. DMARQ Asserted by the device when it is ready to transfer data to or from the host. INTRQ Interrupt request. This active high signal is used to inform the computer that a data transfer is requested or that a command has terminated.
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C H A P T E R 3 I/O Features External Video Monitor 3 The PowerBook 3400 computer has a built-in connector for an external video monitor. The connector is a standard DB9/15 connector for use with a VGA or SVGA monitor. An optional adapter allows the user to attach a standard Apple video cable. Monitors Supported 3 With the adapter, the computer can display on any Apple monitor, including the AV monitors and the 17-inch and 20-inch multiple scan monitors.
C H A P T E R 3 I/O Features Table 3-3 Monitors and pixel depths supported (continued) Monitor type Resolution Bits per pixel Apple 20-inch multiple scan 640 by 480 1, 4, 8, 16 Apple 20-inch multiple scan 800 by 600* 1, 4, 8, 16 Apple 20-inch multiple scan 832 by 624 1, 4, 8 Apple 20-inch multiple scan 1024 by 768 1, 4, 8 NTSC TV monitor 512 by 384* 1, 4, 8, 16, 24 NTSC TV monitor 640 by 480 1, 4, 8, 16 PAL TV monitor 640 by 480* 16 only PAL TV monitor 768 by 576 1, 4, 8, 16
C H A P T E R 3 I/O Features Table 3-4 Signals on the video connector Pin Signal name Description 1 RED Red video signal 2 GREEN Green video signal 3 BLUE Blue video signal 4 MONID(0) Monitor ID signal 0 5 GND DDC return 6, 7, 8 AGND_VID Analog video ground 9 +5V_IO 5 V power for I/O device 10 GND HSYNC and VSYNC ground 11 VGA_ID VGA ID signal 12 MONID(2) Monitor ID signal 2 13 HSYNC Horizontal synchronization signal 14 VSYNC Vertical synchronization signal 15 MO
C H A P T E R 3 I/O Features Table 3-5 Monitor sense codes Standard sense codes Monitor type Extended sense codes (2–0) (1, 2) (0, 2) (0, 1) 12-inch RGB 010 n.a. n.a. n.a. 13-inch RGB 110 n.a. n.a. n.a. Portrait 001 n.a. n.a. n.a. 16-inch RGB 111 10 11 01 17-inch multiscan 110 11 01 00 VGA and SVGA 111 01 01 11 No monitor 111 11 11 11 Note Both VGA and SVGA monitors have the same sense code.
C H A P T E R 3 I/O Features communicate with a variety of ISDN and other telephone transmission facilities. For more information, refer to Macintosh Technote Number 1018, Serial DMA. Table 3-6 shows the signal assignments for the serial port.
C H A P T E R 3 I/O Features Table 3-7 SCSI connector signals (continued) Pin Signal name Pin Signal name 5 TERMPWR (not used; reserved) 20 GND 6 /DB2 21 /REQ 7 /DB3 22 GND 8 GND 23 /BSY 9 /ACK 24 GND 10 GND 25 /ATN 11 /DB4 26 /C/D 12 GND 27 /RST 13 GND 28 /MSG 14 /DB5 29 /SEL 15 GND 30 /I/O ADB Port 3 The Apple Desktop Bus (ADB) port on the PowerBook 3400 computer is functionally the same as on other Macintosh computers.
C H A P T E R 3 I/O Features status from the selected external device. A 4-pin mini-DIN connector connects the ADB controller to the outside world. Table 3-8 lists the ADB connector pin assignments. For more information about the ADB, see Guide to the Macintosh Family Hardware, second edition.
C H A P T E R 3 I/O Features The modulation method used in the Newton PDA consists of gating a 500-kHz carrier on and off. This method is capable of data rates up to 38.4k bits per second. Apple currently has no plans to support Macintosh to Newton connectivity using this method due to its low data rate. Future Newton PDAs will support the IrDA standard. The IrDA modulation method complies with the IrDA physical layer standard, which can be found at ftp://irda.org.
C H A P T E R 3 I/O Features Built-in Microphone 3 The sound signal from the built-in microphone goes through a dedicated preamplifier that raises its nominal 30-mV level to the 1-V level of the codec circuits in the AWAC IC. External Sound Input 3 The external sound input jack accepts a line-level signal or an Apple PlainTalk microphone. When a connector is plugged into the external sound input jack, the computer turns off the sound input from the built-in microphone.
C H A P T E R 3 I/O Features ■ output impedance: 33 Ω ■ minimum recommended load impedance: 32 Ω ■ maximum level: 1 V rms ■ maximum current: 32 mA peak Internal Speakers 3 The computer has a total of four internal speakers: two 20 mm speakers located beneath the bezel between the back of the keyboard and the display, and two 50 mm speakers located in a tuned port enclosure in the back of the display.
C H A P T E R 3 I/O Features Ethernet-Only Card 3 The ethernet-only card provides a 10 Mbps ethernet interface with a 10baseT connection. The ethernet interface conforms to the ISO/IEC 8802-3 specification, where applicable. 34 Ethernet and Modem Cards Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R Figure 4-0 Listing 4-0 Table 4-0 4 Expansion Modules 4 35 Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules This chapter describes each of the expansion features of the PowerBook 3400 computer: ■ PCI expansion slot ■ expansion bay ■ RAM expansion ■ PC Card slot PCI Expansion Slot 4 The PowerBook 3400 computer has an internal slot for an expansion card. The card fits between the expansion bay and the PC Card slots. The user can get access to the expansion card by removing the keyboard.
C H A P T E R 4 Expansion Modules Table 4-1 Signal assignments on the PCI expansion connector (continued) Pin Signal name Pin Signal name 13 PCIAD(28) 63 PCIAD(11) 14 PCIAD(29) 64 +3V_MAIN 15 GND 65 GND 16 GND 66 GND 17 PCIAD(26) 67 PCIAD(9) 18 PCIAD(27) 68 PCIAD(10) 19 PCIAD(24) 69 /PCICBE(0) 20 PCIAD(25) 70 PCIAD(8) 21 +5V_MAIN 71 /PCMCIA_IRQ2 22 PCIAD(23) 72 PCIAD(7) 23 PCIAD(22) 73 PCIAD(6) 24 +3V_MAIN 74 /PCMCIA_IRQ1 25 GND 75 GND 26 GND 76
C H A P T E R 4 Expansion Modules Table 4-1 Signal assignments on the PCI expansion connector (continued) Pin Signal name Pin Signal name 44 +3V_MAIN 94 PSLOT_IDSEL 45 GND 95 MB_COM_OUT 46 GND 96 PSLOT_SND_COM 47 /PCISTOP 97 MB_R_OUT 48 /PCIDEVSEL 98 PSLOT_SND_R 49 /PCIPERR 99 MB_L_OUT 50 /PCILOCK 100 PSLOT_SND_L PCI Signals 4 The PCI signals on the expansion card conform to the standards for 32-bit-wide PCI with 3.3 V signaling.
C H A P T E R 4 Expansion Modules Expansion Card Design 4 This section describes the mechanical design of the PCI expansion card. Figure 4-1 shows a perspective view of the expansion card and its orientation.
C H A P T E R 4 Expansion Modules Figure 4-2 Connectors on the PCI expansion card 11.98 [0.472] Pin 1 External connector 101.72 [4.005] Internal connector 9.25 [0.364] 17.50 [0.689] Pin 1 Note: Dimensions are in millimeters [inches]. Note The following tolerances apply to all the drawings in this section: One digit after the decimal point (X.X): ±0.20 [0.01] Two digits after the decimal point (X.XX): ±0.13 [0.005] Three digits after the decimal point (X.XXX): ±0.100 [0.
C H A P T E R 4 Expansion Modules Figure 4-3 Location of external connector RJ45 connector 18.37 [0.723] RJ45 connector, accessible through hole in rear bottom case 14.0 [0.55] 4.73 [0.186] 15.87 [0.625] Note: Dimensions are in millimeters [inches]. PCI Expansion Slot Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-4 Shielded RJ45 connector 15.87 [0.625] 14.0 [0.55] 17.15 [0.675] 21.3 [0.84] Note: Dimensions are in millimeters [inches]. Grounding the External Connector 4 To prevent excessive electromagnetic radiation, the external connector on the PCI expansion card must be a shielded connector. The computer’s case has conductive metal fingers that make electrical contact with the shield and ground it to the case.
C H A P T E R 4 Expansion Modules Figure 4-6 Expansion card internal connector 5.20 [0.205] 38.62 [1.52] 9.00 [0.354] 33.62 [1.324] 0.60 [0.024] Note: Dimensions are in millimeters [inches]. Card Dimensions 4 Figure 4-7 shows the dimensions of the internal PCI expansion card. PCI Expansion Slot Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-7 Dimensions of the PCI expansion card 39.99 [1.575] 28.89 [1.138] 10.34 [0.407] 20.20 [0.795] ø4.20 [0.165] Mounting hole 118.45 [4.663] R1.00 [0.039 106.32 [4.186] 100.50 [3.957] 80.54 [3.171] ø4.20 [0.165] Mounting slot 2X R 0.5 [0.020] 4.20 [0.165] 3.03 [0.119] 43.00 [1.693] 45° 44 PCI Expansion Slot Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Component Height Limits 4 Figure 4-8 shows a general view of the maximum component heights on the internal PCI expansion card. Figure 4-9 shows the height limits on the top of the card, and Figure 4-10 shows the height limits on the bottom of the card. Figure 4-8 PCI expansion card maximum component space Rear of computer Maximum component geometry PCI Expansion Slot Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-9 Maximum component heights on the top of the PCI expansion card 15.29 [0.602] 9.00 [0.354] Component height restricted to 1.75 [0.069] maximum. 11.00 [0.433] Component height restricted to 3.20 [0.126] maximum. Conductive component height restricted to 1.35 [0.053] maximum. 97.03 [3.820] 65.24 [2.568] ;; ;; ;; ;; ;; 58.50 [2.303] 6.00 [0.236] 35.49 [1.397] No components or traces allowed. Component height restricted to 3.85 [0.152] maximum.
C H A P T E R 4 Expansion Modules Figure 4-10 Maximum component heights on the bottom of the PCI expansion card 19.41 [0.764] 7.60 [0.299] No components allowed Component height restricted to 4.50 [0.177] maximum R 3.80 [0.150] Component height restricted to 3.50 [0.138] maximum Component height restricted to 6.00 [0.236] maximum 54.00 [2.126] Component height restricted to 3.92 [0.154] maximum 83.04 [3.269] 5.80 [0.228] 24.35 [0.959] 13.15 [0.518] 17.21 [0.678] 21.19 [0.834] ø7.60 [0.
C H A P T E R 4 Expansion Modules Figure 4-11 Heatsink for the PCI expansion card Rear of computer Heat transfer pad adhered to hot component Heat sink 3.20 [0.126] 3.85 [0.151] 65.24 [2.568] Bottom case Note: Dimensions are in millimeters [inches]. An insulating layer between the heatsink and the PCI expansion card prevents electrical shorts between the heatsink and tall components on the card.
C H A P T E R 4 Expansion Modules Expansion Card Operation and Sleep Mode 4 Power is constantly supplied to the PCI expansion card while the computer is in sleep mode. The circuitry on the card can monitor the SLEEP and /CFW_3V signals to determine the state of the computer. During sleep mode, the card must reduce its power consumption to a maximum of 3.3 mW. All clocks become inactive and are driven low when the computer switches to sleep mode. All PCIAD signals are driven low during sleep mode.
C H A P T E R 4 Expansion Modules Depending on the power requirements of the devices on the expansion card, it may be necessary to provide low-power operation of the PCI interface IC. The circuit in Figure 4-13 is similar to the one in Figure 4-12, except it also switches the power to the PCI interface IC. The following control signals are connected to pull-up resistors on the main logic board: /DEVSEL, /FRAME, /GRANT, /INT, /IRDY, /LOCK, /PERR, /REQ, /SERR, /STOP, and /TRDY.
C H A P T E R 4 Expansion Modules Timing of Control Signals in Sleep Mode 4 Figure 4-14 shows the timing of the control signals on the PCI expansion card when the computer goes into and out of sleep mode. Figure 4-14 Timing of the expansion card control signals for sleep mode /CFW SLEEP PCICLK AD, C/BE Controls* /PCI_RST_3V t1 t2 t3 t1 = 16 ms min. /CFW to clocks stopped t2 = 16 ms min. Clocks stopped to system sleep t3 = 50 ms min.
C H A P T E R 4 Expansion Modules developers design devices that operate properly when the computer switches from one power mode to another. Note These power sequences apply to both the internal PCI expansion slot and a PCI device in an expansion bay module. ◆ Power Sequence From Off to On 4 Here is the sequence of states and events when the computer switches from off to on: 1. The computer is in the power-off mode. 2. The PMU detects power on. 3. The main power supplies (+5V, +3.3V, and +2.
C H A P T E R 4 Expansion Modules Power Sequence From Sleep to On 4 Here is the sequence of states and events when the computer switches from sleep to on: 1. The computer is in sleep mode. 2. The PMU detects keyboard activity or the power-on switch. 3. The SLEEP signal changes to low (inactive). 4. The clocks begin operating. 5. The /CFW signal changes to high (inactive). 6. An interrupt is sent to the main processor. 7. The processor starts executing code. 8.
C H A P T E R 4 Expansion Modules Expansion Bay Module 4 Figure 4-15 shows a module designed to fit into the expansion bay. A notch on the side of the module engages a catch inside the computer to prevent the module from being pulled out.
C H A P T E R 4 Expansion Modules Figure 4-16 Rear view of expansion bay module External surface Connector Locking notch Datum locating slot Figure 4-17 Location of expansion bay connector and datum slot Datum slot centerline Datum slot Connector centerline 4.00 [0.157] 1.70 [0.067] 29.44 [1.159] 15.30 [0.602] 37.50 [1.476] Note: Dimensions are in millimeters [inches]. Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Maximum Dimensions 4 Figure 4-18 shows the maximum dimensions of a module that can be accommodated by the expansion bay. Figure 4-18 Maximum dimensions of the expansion module 128.00 [5.039] 29.44 [1.159] Datum slot centerline 145.75 [5.738] Note: Dimensions are in millimeters [inches]. 56 Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Location of the Circuit Board and Connectors 4 Figure 4-19 is an exploded view of a typical expansion bay module showing the locations of the circuit board and the connectors. Figure 4-19 Exploded view of expansion bay module Top case Internal connector External connectors Circuit board Screw bosses PCB locating bosses Bottom case Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-20 shows the recommended method of installing the circuit board in the expansion module. This pin and slot arrangement provides accurate location of the board without overconstraining it. Figure 4-20 Suggested locations of circuit board and connector 4X mounting holes Boss in bottom case locates hole in PCB Slot in PCB aligns to boss in bottom case Localized thin zone to clear connector 2mm wall plastic 0.40 [0.
C H A P T E R 4 Expansion Modules Figure 4-21 and Figure 4-22 show typical and alternative ways of mounting the connectors. Figure 4-21 Locations of connectors Connectors recessed below the external surface Figure 4-22 Alternate mounting for connector Connector mounts vertical to PCB 0.40 [0.016] Note: Dimensions are in millimeters [inches]. Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-23 shows the maximum dimensions of the circuit board and the location of the expansion bay connector. Figure 4-23 Suggested dimensions of circuit board 135.5 [5.335] 57.56 [2.266] 84.10 [3.311] 121.00 [4.764] Connector 1.50 [0.059] 5.44 [0.214] 36.25 [1.427] Maximum component height in this area 10.25 [0.404] Note: Dimensions are in millimeters [inches]. 60 Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Figure 4-24 shows the maximum component height on the bottom of the circuit board. Figure 4-24 Maximum component height on bottom of circuit board Connector Maximum component height in this area 2.00 [0.079] Note: Dimensions are in millimeters [inches]. Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Grounding the Module 4 If the device in the expansion bay module requires grounding to reduce electromagnetic radiation, the module should be provided with electrically grounded conductive surfaces as shown in Figure 4-25 and Figure 4-26. Figure 4-25 Electrical grounding surfaces, top view Ground plane contact surface 4X R 1.00 98.51 [3.878] Centerline of datum slot 26.67 [1.050] 123.31 [4.855] Note: Dimensions are in millimeters [inches].
C H A P T E R 4 Expansion Modules Figure 4-26 Electrical grounding surfaces, bottom view 3X 7.00 [0.276] 3X 99.01 [3.898] 20.00 [0.787] Ground plane contact surfaces 10.00 [0.394] 40.00 [1.575] 3X 26.00 [1.024] 12X R1.00 [0.039] Expansion Bay Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 4 Expansion Modules Mechanical Support Areas 4 The expansion bay comes in contact with the module and supports it in the areas shown in Figure 4-27 and Figure 4-28. Those areas should not be recessed below the surface of the module. Figure 4-27 Mechanical contact areas, top view 131.31 [5.170] 4.15 [0.163] 10.12 [0.398] 9.98 [0.393] 10.27 [0.404] 7X R. Full 4X 2.00 [0.079] 96.50 [3.799] 77.06 [3.034] Centerline of datum slot 67.08 [2.641] 28.00 [1.102] 3.47 [0.137] 10.78 [0.
C H A P T E R 4 Expansion Modules Figure 4-28 Mechanical contact areas, bottom view 15X 2.00 [0.079] Centerline of datum slot 3X 21.00 [0.827] 3X 37.00 [1.457] 3X 87.00 [3.425] 3X 7.00 [0.276] 3X 67.00 [2.638] 5X 10.32 [0.406] 5X 50.33 [1.981] 5X 90.33 [3.556] 15X 18.25 [0.719] Note: Dimensions are in millimeters [inches]. Expansion Bay Connector 4 The expansion bay connector is a 90-pin shielded connector. The pins are divided into two groups by a gap.
C H A P T E R 4 Expansion Modules Figure 4-29 Section through expansion bay connector 14.65 [0.577] 9.45 [0.372] 5.00 [1.97] 3.50 [0.138] Contacts 6.45 [0.254] Note: Dimensions are in millimeters [inches]. IMPORTANT The expansion bay connector is designed so that when a module is inserted into the bay, the first connection is the ground by way of the connector shells, then the power pins make contact, and last of all the signal lines.
C H A P T E R 4 Expansion Modules Table 4-3 Device ID signals and types of devices (continued) DEV_ID(2) DEV_ID(1) DEV_ID(0) Type of device 1 0 0 Reserved 1 0 1 PCI device 1 1 0 Power input device 1 1 1 No device installed PCI Signals on the Expansion Bay Connector 4 Table 4-4 shows the signal assignments on the expansion bay connector when it is used with a PCI device. Signal names that begin with a slash (/) are active low.
C H A P T E R 4 Expansion Modules Table 4-4 Pin PCI signals on the expansion bay connector (continued) Direction Signal name Pin Direction Signal name continued 18 O /GNT 63 I/O /PERR 19 I/O PAR 64 O /BUF_PCI_RST GND 65 I/O /IRDY I/O /FRAME 20 21 I/O /TRDY 66 22 I/O /SERR 67 23 I/O /DEVSEL 68 I/O /LOCK 24 I/O /STOP 69 I/O AD(0) LONG GND 70 I/O AD(1) AD(2) 71 I/O AD(3) +3V 72 I/O AD(4) I/O AD(6) 25 26 I/O 27 28 I/O AD(5) 73 29 I/O AD(7) 74
C H A P T E R 4 Expansion Modules PCI Control Signals in Sleep Mode 4 The following PCI control signals are disconnected from the expansion bay during sleep: /DEVSEL, /FRAME, /GRANT, /INT, /IRDY, /LOCK, /PERR, /REQ, /SERR, /STOP, and /TRDY. PCI devices on a module in the expansion bay should have these signals pulled up through 100 KΩ resistors to the PCI device Vcc.
C H A P T E R 4 Expansion Modules Figure 4-31 Timing of the expansion bay control signals during power on /DEV_IN /MB_PWREN +3 V, +5 V /BUF_PCI_RST and /IDE_RST AD, C/BE, and controls* Hi-Z t1 t2 t3 t 1 = 250 ms min. t 2 = 5 ms min. t 3 = 10 ms min.
C H A P T E R 4 Expansion Modules ATA and Floppy Disk Signals on the Expansion Bay Connector 4 Table 4-5 shows the signal assignments on the expansion bay connector when it is used with an ATA device or a floppy disk drive. Signal names that begin with a slash (/) are active low. Note The table shows the signals in the same arrangement as the pins on the connector; that is, with pin 1 next to pin 46 and pin 45 next to pin 90.
C H A P T E R 4 Expansion Modules Table 4-5 Pin ATA and floppy disk signals on the expansion bay connector (continued) Direction 23 24 I 25 26 I/O 27 Signal name Pin n.c. 68 Direction Signal name IOCHRDY 69 I/O IDE_D(0) LONG GND 70 I/O IDE_D(1) IDE_D(2) 71 I/O IDE_D(3) +3V 72 I/O IDE_D(4) I/O IDE_D(6) n.c.
C H A P T E R 4 Expansion Modules Table 4-6 Audio and control signals on the expansion bay connector Signal name Signal description DEV_ID(0–2) These three signal lines identify the type of expansion bay device. Table 4-3 shows the identification codes for different devices. /DEV_IN This signal should be low whenever a device is installed in the expansion bay; it is used by the O’Hare IC to determine when a device has been inserted or removed.
C H A P T E R 4 Expansion Modules Table 4-8 ATA signals on the expansion bay connector (continued) Signal name Signal description continued IDE_ADDR(0–2) IDE device address; used by the computer to select one of the registers in the drive. For more information, see the descriptions of the /CS1FX and /CS3FX signals. IDE_D(0–15) IDE data bus, buffered from IOD(16–31) of the controller IC. IDE_D(0–15) are used to transfer 16-bit data to and from the drive buffer.
C H A P T E R 4 Expansion Modules Power on the Expansion Bay Connector 4 Table 4-10 describes the power lines on the expansion bay connector. The MB_+5V and MB_+3V lines are controlled by the /MB_PWR signal from the O’Hare IC. Table 4-10 Power lines on the expansion bay connector Signal name Signal description GND Ground. MB_+5V 5 V power; maximum total current is 1.0 A. MB_+3V 3 V power; maximum total current is 1.5 A.
C H A P T E R 4 Expansion Modules 2. System software responds to the interrupt and notifies the appropriate driver that the module has been removed. Guidelines for Developers 4 Each expansion bay module must be designed to prevent damage to itself and to the computer when the user inserts or removes an expansion bay module with the computer running. The expansion bay connector is designed so that when the module is inserted the ground and power pins make contact before the signal lines.
C H A P T E R 4 Expansion Modules Table 4-11 Signal assignments on the RAM expansion connector Pin Signal name Pin Signal name 1 GND 2 GND 3 GND 4 GND 5 GND 6 /CAS(6) 7 GND 8 /CAS(4) 9 +12V_MAIN 10 /CAS(5) 11 /RAS(4) 12 /RAS(2) 13 /RAS(1) 14 RADDR(9) 15 RADDR(8) 16 RADDR(10) 17 RADDR(7) 18 RADDR(0) 19 RADDR(6) 20 RADDR(1) 21 RADDR(5) 22 RADDR(2) 23 RADDR(4) 24 RADDR(3) 25 DATA(32) 26 DATA(0) 27 GND 28 GND 29 DATA(33) 30 DATA(1) 31 +3V_MAI
C H A P T E R 4 Expansion Modules Table 4-11 78 Signal assignments on the RAM expansion connector (continued) Pin Signal name Pin Signal name 63 DATA(15) 64 DATA(47) 65 DATA(14) 66 DATA(46) 67 DATA(13) 68 DATA(45) 69 +3V_MAIN 70 +3V_MAIN 71 DATA(12) 72 DATA(44) 73 DATA(19) 74 DATA(51) 75 DATA(18) 76 DATA(50) 77 DATA(17) 78 DATA(49) 79 DATA(16) 80 DATA(48) 81 DATA(23) 82 DATA(55) 83 DATA(22) 84 DATA(54) 85 DATA(21) 86 DATA(53) 87 GND 88 GND 89 DA
C H A P T E R 4 Expansion Modules IMPORTANT The RAM expansion connector is the same type as the one in the PowerBook 5300, but it is oriented in the opposite direction and the pin assignments are different. A RAM expansion card designed for the PowerBook 5300 will not work in a PowerBook 3400 computer. ▲ Signal Descriptions 4 Table 4-12 describes the signals on the RAM expansion connector. Signal names that begin with a slash (/) are active low.
C H A P T E R 4 Expansion Modules address signals are stable before the RAS transition, RAM expansion cards must have buffers on the address lines; see “RAM Expansion Card Electrical Limits” beginning on page 82. Address Multiplexing 4 Signals RA(0-11) are a 12-bit multiplexed address bus and can support several different types of DRAM devices. Depending on their internal design and size, different types of DRAM devices require different row and column address multiplexing.
C H A P T E R 4 Expansion Modules Table 4-13 Address multiplexing for some types of DRAM devices (continued) DRAM address signals connected to device address pins Type of DRAM device [11] [10] [9] [8] [7] [6] [5] [4] [3] [2] [1] [0] Row address bits – – 10 11 12 13 14 15 16 17 18 19 Column address bits – – 9 20 21 22 23 24 25 26 27 28 Row address bits – 8 10 11 12 13 14 15 16 17 18 19 Column address bits – – 9 20 21 22 23 24 25 26 27 28 R
C H A P T E R 4 Expansion Modules Banks are selected by individual signals /RAS(0–4) as shown in Table 4-14.
C H A P T E R 4 Expansion Modules The capacitive loading on the signal lines must not exceed the following limits: ■ DATA(0–63): 50 pF ■ RADDR(0–11): 140 pF ■ /RAMWE: 140 pF ■ RAMOE: 140 pF ■ /RAS(n): 80 pF ■ /CAS(n): 50 pF Buffers on the Ram Expansion Card 4 The RAM expansion card must have buffers on the RADDR(0–11), /RAMWE, RAMOE, /RAS(n), and /CAS(n) signals.
C H A P T E R 4 Expansion Modules When the card is installed in the computer, the components and the connector are on the bottom of the card. Figure 4-34 shows the component height restrictions on the card. Except for the connector, the maximum component height is 1.42 mm (0.056 inches). No components or leads are allowed on the reverse (top) side of the card. As shown in Figure 4-34, the thickness of the card is 0.75 mm (0.030 inches). Figure 4-33 Dimensions of the RAM expansion card 89.30 [3.
C H A P T E R 4 Expansion Modules Figure 4-34 Height restrictions on the RAM expansion card Component height restricted to 1.42 [0.56] maximum 4X R 1.52 [0.060] 0.75 [0.030] No components or component leads allowed Note: Dimensions are in millimeters [inches]. PC Card Expansion 4 The computer has a slot with two sockets that can accept either two type II PC Cards (PCMCIA) or one type III PC Card. This section summarizes the features and specifications of the PC Card slots.
C H A P T E R 4 Expansion Modules device representation so it already supports mass storage cards. Apple Computer has extended the metaphor to include I/O cards as well. The user can insert or remove a PC Card while the computer is operating. The user can eject a PC Card either by selecting Eject in Finder menu or by dragging the card’s icon to the trash. PowerBook computers currently support PC Card ejection by software command.
C H A P T E R 4 Expansion Modules The zoom video signals from the lower PC Card slot are accompanied by stereo audio signals in PCM (pulse-code modulated) format.
C H A P T E R 4 Expansion Modules 88 PC Card Expansion Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R Figure 5-0 Listing 5-0 Table 5-0 5 Software Features Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
C H A P T E R 5 Software Features This chapter describes the new features of the software in the ROM of the Macintosh PowerBook 3400 computer. Note The system software shipped with the PowerBook 3400 computer is Mac OS system 7.6. For documentation, developers should refer to TECHNOTE: System 7.6. The technote is available on the Developer CD Series and on the technote web site at . ◆ The ROM includes new tables and code for identifying the machine.
C H A P T E R 5 Software Features OpenFirmware to install device drivers and Macintosh OS Services (Toolbox Managers), and finally the system ROM loads the rest of the operating system from the startup disk. The following sections describe the new features of each of the major modules in the ROM.
C H A P T E R 5 Software Features BootPowerPC ROM 5 When the PowerPC 603ev processor is released from reset, it begins executing the BootPowerPC code. This code includes exception handling, power-on self tests (POST), hardware initialization, the PowerPC nano-kernel, and the 68LC040 Emulator.
C H A P T E R 5 Software Features ■ DMA accesses on both ATA buses ■ new expansion bay manager API for detecting device insertion and removal ■ new Card & Socket Services model ■ now fully native for the PowerPC processor The ATAPI driver now supports 4x and 6x CDROM drives in the expansion bay. The driver supports audio compact discs as well as data discs. Floppy Disk Driver 5 The new floppy disk driver can read disks that use Microsoft’s distribution floppy format (DMF, 1.6 MB FM).
C H A P T E R 5 Software Features PC Card Manager 5 The PC Card ROM software includes built-in clients for ATA devices (disk drives), SRAM cards, and 16550-based modem cards. The ATA devices are handled by the ATA Manager, although the ATA client is responsible for configuring the card for ATA operation. The SRAM client is a complete driver capable of supporting any file system available from the Mac OS (currently Macintosh HFS and PC FAT).
C H A P T E R 5 Software Features The video driver supports the hardware cursor when the display is set to 8 bpp (256 colors) or 16 bpp (thousands of colors). In the other display modes the conventional software cursor is used. The hardware cursor does not appear different, but it should provide improved performance when the application is drawing under the cursor—for example, when the user moves the cursor over a QuickTime movie that is playing.
C H A P T E R 5 Software Features 96 Macintosh System ROM Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
Glossary 680x0 code Instructions that can run on a PowerPC microprocessor only by means of an emulator. See also native code. direct memory access (DMA) A process for transferring data rapidly into or out of RAM without passing it through a processor or buffer. ADB See Apple Desktop Bus. distribution media format (DMF) A format for 3.5-inch floppy disks. By putting three more sectors in each track (21 instead of 18), it provides 1.7 MB of storage instead of the conventional 1.4 MB on a 3.
G L O S S A RY mini-DIN An international standard form of cable connector for peripheral devices. native code Instructions that run directly on a PowerPC microprocessor. See also 680x0 code. Serial Communications Controller (SCC) Circuitry on the Combo IC that provides an interface to the serial data ports. SIMM See Single Inline Memory Module. nonvolatile RAM RAM that retains its contents even when the computer is turned off; also known as parameter RAM.
Index Numerals serial port 28 video 25 custom ICs AWAC 15, 31 O’Hare 14 PSX 12 68HC05 microprocessor 15 68K ROM 92 A AC adapter 6 access to internal components 23 ADB (Apple Desktop Bus) port 29 ADB connector 30 appearance 4 ATA disk interface 18 ATA hard disk 18 connector pin assignments on 20 data bus 22 dimensions and mounting holes 18 signals 21 ATA Manager 92 ATAPI driver 93 AWAC custom IC 15, 31 D DDC monitors 26 device handlers 93 direct memory access (DMA) 14 display controller IC 16 displays ex
I N D E X datum slot on 54 dimensions 56 grounding of 62 insertion and removal of 93 installation by the user 75 support areas 64 expansion card.
I N D E X PCI bus 12, 13, 14–16 PCI bus bridge 12–13 PCI expansion card access to 36 component height limits 45–47 dimensions 43 external connector 40 grounding 42 internal connector 42 mechanical design 39–47 power-down requirement 51 power sequences 52–53 off to on 52 on to off 53 on to sleep 52 sleep to on 53 sleep mode 49–51 thermal considerations 47 PCI expansion slot 36–53 connector signal assignments on 36 other signals on 38 PCI signals on 38 signals 36–38 peripheral devices 6 peripheral support IC
I N D E X T trackball 22 trackpad 22 U user installation of expansion bay modules 75 V, W VGA monitors 24, 27 VIA controller IC 14 video connector 25 video driver 94 video for external monitor 24–27 video mirroring 95 video monitor adapter 26 video monitors 24 adapter for 26 DDC monitors 26 sense codes 26 VGA and SVGA monitors 24, 27 X, Y, Z zoom video 16, 86 102 Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
I N D E X 103 Launch Draft. Preliminary, Confidential. ©2000 Apple Computer, Inc.
Developer Press Art List Writer Prod. Editor # of Figures Allen Watson Hooper Developer Note Art Director Alex Solinsky Illustrator 45 Draft stage Sandee Karr & Bruce Lee Sandee Karr & Bruce Lee launch Figure # Path Name Caption Figure 1-1 art files:HP-01 Front view of the computer..................................................................................... 4 Figure 1-2 art files:HP-02 Back view of the computer .......................................................................
Figure 4-20 art files:HP-25 Suggested locations of circuit board and connector.............................................. 58 Figure 4-21 art files:HP-26 Locations of connectors......................................................................................... 59 Figure 4-22 art files:HP-27 Alternate mounting for connector ......................................................................... 59 Figure 4-23 art files:HP-28 Suggested dimensions of circuit board..........................
