Datasheet
Table Of Contents
- RP2040 Datasheet
- Colophon
- Chapter 1. Introduction
- Chapter 2. System Description
- 2.1. Bus Fabric
- 2.2. Address Map
- 2.3. Processor subsystem
- 2.4. Cortex-M0+
- 2.5. DMA
- 2.6. Memory
- 2.7. Boot Sequence
- 2.8. Bootrom
- 2.9. Power Supplies
- 2.10. Core Supply Regulator
- 2.11. Power Control
- 2.12. Chip-Level Reset
- 2.13. Power-On State Machine
- 2.14. Subsystem Resets
- 2.15. Clocks
- 2.16. Crystal Oscillator (XOSC)
- 2.17. Ring Oscillator (ROSC)
- 2.18. PLL
- 2.19. GPIO
- 2.20. Sysinfo
- 2.21. Syscfg
- 2.22. TBMAN
- Chapter 3. PIO
- Chapter 4. Peripherals
- 4.1. USB
- 4.2. UART
- 4.3. I2C
- 4.3.1. Features
- 4.3.2. IP Configuration
- 4.3.3. I2C Overview
- 4.3.4. I2C Terminology
- 4.3.5. I2C Behaviour
- 4.3.6. I2C Protocols
- 4.3.7. Tx FIFO Management and START, STOP and RESTART Generation
- 4.3.8. Multiple Master Arbitration
- 4.3.9. Clock Synchronization
- 4.3.10. Operation Modes
- 4.3.11. Spike Suppression
- 4.3.12. Fast Mode Plus Operation
- 4.3.13. Bus Clear Feature
- 4.3.14. IC_CLK Frequency Configuration
- 4.3.15. DMA Controller Interface
- 4.3.16. Operation of Interrupt Registers
- 4.3.17. List of Registers
- 4.4. SPI
- 4.5. PWM
- 4.6. Timer
- 4.7. Watchdog
- 4.8. RTC
- 4.9. ADC and Temperature Sensor
- 4.10. SSI
- 4.10.1. Overview
- 4.10.2. Features
- 4.10.3. IP Modifications
- 4.10.4. Clock Ratios
- 4.10.5. Transmit and Receive FIFO Buffers
- 4.10.6. 32-Bit Frame Size Support
- 4.10.7. SSI Interrupts
- 4.10.8. Transfer Modes
- 4.10.9. Operation Modes
- 4.10.10. Partner Connection Interfaces
- 4.10.11. DMA Controller Interface
- 4.10.12. APB Interface
- 4.10.13. List of Registers
- Chapter 5. Electrical and Mechanical
- Appendix A: Register Field Types
- Appendix B: Errata
- Appendix C: Documentation Release History
Chapter 5. Electrical and Mechanical
Physical and electrical details of the RP2040 chip.
5.1. Package
PIN 1
Figure 166. Top down
view (left, top) and
side view (right, top),
along with bottom
view (left, bottom) of
the RP2040 QFN-56
package
NOTE
There is no standard size for the central GND pad (or ePad) with QFNs. However, the one on RP2040 is smaller than
most. This means that standard 0.4mm QFN-56 footprints provided with CAD tools may need adjusting. This gives
the opportunity to route between the central pad and the ones on the periphery, which can help with maintaining
power and ground integrity on cheaper PCBs. See Minimal Design Example for an example.
5.1.1. Recommended PCB Footprint
RP2040 Datasheet
5.1. Package 628