Datasheet
Table Of Contents
- RP2040 Datasheet
- Colophon
- Chapter 1. Introduction
- Chapter 2. System Description
- 2.1. Bus Fabric
- 2.2. Address Map
- 2.3. Processor subsystem
- 2.4. Cortex-M0+
- 2.5. DMA
- 2.6. Memory
- 2.7. Boot Sequence
- 2.8. Bootrom
- 2.9. Power Supplies
- 2.10. Core Supply Regulator
- 2.11. Power Control
- 2.12. Chip-Level Reset
- 2.13. Power-On State Machine
- 2.14. Subsystem Resets
- 2.15. Clocks
- 2.16. Crystal Oscillator (XOSC)
- 2.17. Ring Oscillator (ROSC)
- 2.18. PLL
- 2.19. GPIO
- 2.20. Sysinfo
- 2.21. Syscfg
- 2.22. TBMAN
- Chapter 3. PIO
- Chapter 4. Peripherals
- 4.1. USB
- 4.2. UART
- 4.3. I2C
- 4.3.1. Features
- 4.3.2. IP Configuration
- 4.3.3. I2C Overview
- 4.3.4. I2C Terminology
- 4.3.5. I2C Behaviour
- 4.3.6. I2C Protocols
- 4.3.7. Tx FIFO Management and START, STOP and RESTART Generation
- 4.3.8. Multiple Master Arbitration
- 4.3.9. Clock Synchronization
- 4.3.10. Operation Modes
- 4.3.11. Spike Suppression
- 4.3.12. Fast Mode Plus Operation
- 4.3.13. Bus Clear Feature
- 4.3.14. IC_CLK Frequency Configuration
- 4.3.15. DMA Controller Interface
- 4.3.16. Operation of Interrupt Registers
- 4.3.17. List of Registers
- 4.4. SPI
- 4.5. PWM
- 4.6. Timer
- 4.7. Watchdog
- 4.8. RTC
- 4.9. ADC and Temperature Sensor
- 4.10. SSI
- 4.10.1. Overview
- 4.10.2. Features
- 4.10.3. IP Modifications
- 4.10.4. Clock Ratios
- 4.10.5. Transmit and Receive FIFO Buffers
- 4.10.6. 32-Bit Frame Size Support
- 4.10.7. SSI Interrupts
- 4.10.8. Transfer Modes
- 4.10.9. Operation Modes
- 4.10.10. Partner Connection Interfaces
- 4.10.11. DMA Controller Interface
- 4.10.12. APB Interface
- 4.10.13. List of Registers
- Chapter 5. Electrical and Mechanical
- Appendix A: Register Field Types
- Appendix B: Errata
- Appendix C: Documentation Release History
5.2.3. Pin Specifications
The following electrical specifications are obtained from characterisation over the specified temperature and voltage
ranges, as well as process variation, unless the specification is marked as 'Simulated'. In this case, the data is for
information purposes only, and is not guaranteed.
5.2.3.1. Absolute Maximum Ratings
Table 629. Absolute
maximum ratings for
digital IO (Standard
and Fault Tolerant)
Parameter Symbol Minimum Maximum Units Comment
I/O Supply Voltage IOVDD -0.5 3.63 V
Voltage at IO V
PIN
-0.5 IOVDD + 0.5 V
5.2.3.2. ESD Performance
Table 630. ESD
performance for all
pins, unless otherwise
stated
Parameter Symbol Maximum Units Comment
Human Body Model HBM 2 kV Compliant with JEDEC
specification JS-001-
2012 (April 2012)
Human Body Model
Digital (FT) pins only
HBM 4 kV Compliant with JEDEC
specification JS-001-
2012 (April 2012)
Charged Device Model CDM 500 V Compliant with
JESD22-C101E
(December 2009)
5.2.3.3. Thermal Performance
Table 631. Thermal
Performance
Parameter Symbol Minimum Typical Maximum Units Comment
Case
Temperature
T
C
-20 85 °C
5.2.3.4. IO Electrical Characteristics
Table 632. Digital IO
characteristics -
Standard and FT
unless otherwise
stated
Parameter Symbol Minimum Maximum Units Comment
Pin Input Leakage
Current
I
IN
1 μA
Input Voltage High
@ IOVDD=1.8V
V
IH
0.65 * IOVDD IOVDD + 0.3 V
Input Voltage High
@ IOVDD=2.5V
V
IH
1.7 IOVDD + 0.3 V
Input Voltage High
@ IOVDD=3.3V
V
IH
2 IOVDD + 0.3 V
Input Voltage Low
@ IOVDD=1.8V
V
IL
-0.3 0.35 * IOVDD V
RP2040 Datasheet
5.2. Pinout 633