Specifications

2
English
1.2 Specications
Platform
•
Mini-ITX Form Factor
•
High Density Glass Fabric PCB
Unique
Feature
ASRock Super Alloy
•
Premium Alloy Choke (Reduces 70% core loss compared to
iron powder choke)
•
Dual-Stack MOSFET (DSM)
•
NexFET
TM
MOSFET
•
12K Plat i nu m Caps (10 0% Japa n made high qua lity
conductive polymer capacitors)
•
Sapphire Black PCB
ASRock 802.11ac WiFi
ASRock HDMI-In
ASRock Full Spike Protection
ASRock Cloud
ASRock APP Shop
CPU
•
Supports 4
th
Gen & 5
th
Generation Intel® Core
th
Processors
(Socket 1150)
•
Digi Power design
•
6 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
•
Supports Intel® K-Series unlocked CPUs
•
Supports ASRock BCLK Full-range Overclocking
Chipset
•
Intel® Z97
Memory
•
Dual Channel DDR3 Memory Technology
•
2 x DDR3 DIMM Slots
•
Supports DDR3 2933+(OC)/2800(OC)/2400(OC)/2133(OC)/
1866(OC)/1600/1333/1066 non-ECC, un-buered memory
•
Max. capacity of system memory: 16GB (see CAUTION)
•
Supports Intel® Extreme Memory Prole (XMP) 1.3 / 1.2
•
15μ Gold Contact in DIMM Slots
Expansion
Slot
•
1 x PCI Express 3.0 x16 Slot (PCIE1: x16 mode)
•
1 x mini-PCI Express Slot: For WiFi + BT Module
•
15μGold Finger in VGA PCIe Slot (PCIE1)