User Manual

ix
Table of Contents
1 Product Description .................................................................................................... 13
1.1 Overview ................................................................................................................................................................ 13
1.1.1 Summary of Mini PC SKUs ........................................................................................................ 13
1.1.2 Summary of Kit and Board SKUs............................................................................................ 13
1.1.3 Feature Summary .......................................................................................................................... 14
2 Product Layout .............................................................................................................. 17
2.1 Board Layout ....................................................................................................................................................... 17
2.1.1 Board Layout (Bottom) ............................................................................................................... 17
2.1.2 Board Layout (Top) ....................................................................................................................... 19
2.1.3 Front Panel ..................................................................................................................................... 20
2.1.4 Back Panel....................................................................................................................................... 20
2.1.5 Chassis Expandability Options ............................................................................................... 21
2.1.6 Block Diagram ................................................................................................................................ 22
3 Feature Descriptions .................................................................................................. 23
3.1 Graphics Subsystem ....................................................................................................................................... 23
3.1.1 Intel® Iris® Xe Graphics ........................................................................................................... 23
3.1.2 Intel® UHD Graphics for 12
th
Gen Intel Processors ..................................................... 24
3.1.3 Display Emulation......................................................................................................................... 24
3.2 SATA Interface................................................................................................................................................... 24
3.3 Real-Time Clock Subsystem ....................................................................................................................... 25
3.4 LAN Subsystem ................................................................................................................................................. 26
3.4.1 RJ-45 LAN Connector with Integrated LEDs ................................................................ 26
3.5 Hardware Management Subsystem ....................................................................................................... 26
3.5.1 Fan Monitoring .............................................................................................................................. 26
3.5.2 System States and Power States ........................................................................................... 26
4 Technical Reference ................................................................................................... 29
4.1 Connectors and Headers ............................................................................................................................. 29
4.1.1 Signal Tables for the Connectors and Headers ............................................................. 29
4.2 Mechanical Considerations ........................................................................................................................ 39
4.2.1 Chassis Images............................................................................................................................... 39
4.2.2 Form Factor ...................................................................................................................................... 41
4.3 Thermal Considerations ................................................................................................................................ 43
4.4 Reliability .............................................................................................................................................................. 44
4.5 Environmental ................................................................................................................................................... 44
5 Overview of BIOS Features ...................................................................................... 46
5.1 Introduction ........................................................................................................................................................ 46
5.2 BIOS Updates .................................................................................................................................................... 46
5.2.1 BIOS Recovery ............................................................................................................................... 46