Manual

Maximus III Formula Motherboard
 3-2133MHz capability-2133MHz capability
Vendor Part No. Size SS/
DS
Chip NO. Timing
Dimm(Bios)
Voltage DIMM socket support
(Optional)
A* B* C*
G.SKILL F3-17066CL9T-6GB-T 6144MB
(Kit of 3)
DS Heat-Sink Package 9-9-9-24
(1066-8-7-7-20)
1.65
• •
Maximus III Formula Motherboard
 3-2000MHz capability-2000MHz capability
Vendor Part No. Size SS/
DS
Chip NO. Timing
Dimm(Bios)
Voltage DIMM socket
support
(Optional)
A* B* C*
Apacer 78.0AGCQ.CBZ(XMP) 3072MB(Kit of 3) SS Heat-Sink Package 9-9-9-27
(1066-8-8-8-20)
N/A
• •
Crucial BL12864BE2009.8SFB3(EPP) 1024MB SS Heat-Sink Package 9-9-9-28
(1333-9-9-9-24)
2
• • •
G.SKILL F3-16000CL7T-6GBPS(XMP) 6144MB(Kit of 3) DS Heat-Sink Package 7-8-7-20
(1066-8-8-8-20)
1.65
• •
G.SKILL F3-16000CL9T-6GBPS(XMP) 6144MB(Kit of 3) DS Heat-Sink Package 9-9-9-24
(1066-8-8-8-20)
1.65
• •
KINGSTON KHX16000D3K2/2GN(EPP) 2048MB(Kit of 2) SS Heat-Sink Package 2.0 • •
KINGSTON KHX16000D3K3/3GX(XMP) 3072MB(Kit of 3) SS Heat-Sink Package 9(1333-9-9-9-24) 1.65 • • •
KINGSTON KHX16000D3ULT1K3/6GX(XMP) 6144MB(Kit 0f 3) DS Heat-Sink Package 8(1066-8-8-8-20) 1.65 • • •
KINGSTON KHX16000D3T1K3/6GX(XMP) 6144MB(Kit of 3) DS Heat-Sink Package 9(1066-8-8-8-20) 1.65 • • •
OCZ OCZ3FXT20002GK 2048MB(Kit of 2) SS Heat-Sink Package 8 1.9 •
OCZ OCZ3P20002GK(EPP) 2048MB(Kit of 2) SS Heat-Sink Package 9 1.9 • •
Gingle 9CAASS37AZZ01D1 2048MB DS Heat-Sink Package 9-9-9-24 N/A • • •
ROG Maximus III Formula 2-15