User’s Manual
Table Of Contents
- About this manual
- Chapter 1: Getting to know your Edge Computer
- Chapter 2: Using your Edge Computer
- Chapter 3: Upgrading your Edge Computer
- 3.1 Removing the bottom cover
- 3.2 Replacing the bottom cover
- 3.3 Installing memory modules
- 3.4 Installing 2.5” storage device
- 3.5 Installing the Mini PCIe card
- 3.6 Installing a nano SIM card
- 3.7 Installing an SD card
- 3.8 Installing the wireless card
- 3.9 Installing an M.2 SSD
- 3.10 Installing the antennas (optional)
- 3.11 Installing the USB 2.0 module (on selected models)
- 3.12 Installing the Serial port module (on selected models)
- 3.13 Installing the PoE LAN module (on selected models)
- 3.14 Installing the VESA mount (optional)
- 3.15 Installing the wall mount
- Chapter 4: BIOS Setup
- 4.1 Getting to know your BIOS
- 4.2 BIOS setup program
- 4.3 Main Menu
- 4.4 Advanced menu
- 4.4.1 Trusted Computing
- 4.4.2 PCH Storage Configuration
- 4.4.3 Onboard Devices Configuration
- 4.4.4 ACPI Settings
- 4.4.5 APM Configuration
- 4.4.6 SMART Settings
- 4.4.7 NCT6116D Super IO Configuration
- 4.4.8 NCT6116D HW Monitor
- 4.4.9 Serial Port Console Redirection
- 4.4.10 CPU Configuration
- 4.4.11 AMI Graphic Output Protocol Policy
- 4.4.12 PCI Subsystem Settings
- 4.4.13 USB Configuration
- 4.4.14 Network Stack Configuration
- 4.4.15 SDIO Configuration
- 4.4.16 Platform Trust Technology
- 4.4.17 Security Configuration
- 4.4.18 Thermal
- 4.5 Security
- 4.6 Boot menu
- 4.7 Save & Exit menu
- 4.8 Updating your BIOS
- Chapter 5: Watchdog Timer
- Appendix
PE200S Series
9
NOTE:
• *The bundled power adapter may vary by model and territories.
• Some bundled accessories may vary with dierent models. For
details on these accessories, refer to their respective user manuals.
• The device illustration is for reference only. Actual product
specications may vary with models.
• I f the device or its components fail or malfunction during normal
and proper use within the warranty period, bring the warranty
card to the ASUS Service Center for replacement of the defective
components.