service overview 1 Chapter Service Overview Carefully read through this chapter for a look at various components of the notebook and necessary cautions and tools before performing any service and repairs. T o provide the best service and support for the ASUS S62 Series, we have provided the below information for technicians from distributors and resellers to perform the complete notebook disassembly and assembly.
service overview S62 Series Overview and Components The ASUS S62 Series Notebook is a product combining the power of Intel® Pentium-M CPU. In this section, an overview for the S62 Series, along with its components, will be presented. S62 Series Overview O V E R V I E W The illustrations below show the notebook’s overview from front view, right side view, left side view, and rear side view. Most of the parts will be discussed in this manual.
service overview USB (2.
service overview C O M P O N E N T S Components The illustrations below show the components of the S62 Series. L C D I N V E R T E R B O A R D LCD Panel* The illustration below shows the LCD display panel. The S62 Series notebook comes with 15.0” TFT LCD Panel. Inverter Board The illustration below shows the inverter board, which is hidden underneath the lower edge of the LCD front bezel.
service overview L C D B R A C K E T S H I N G E L C D C O V E R C A S E LCD bracket The illustration below shows the LCD brackets. Hinge Cover The illustration below shows the Hinge Cover. LCD Case The illustration below shows the LCD case. Here is the LCD bezel.
service overview K E Y B O A R D T O P C A S E B A T T E R Y Keyboard The illustration below shows the keyboard plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., German, Russian, British, Italian and others. Top Case Module The illustration below shows the top case of the notebook. Battery Pack The illustration below shows the battery pack of the notebook. It’s located at bottom of the notebook.
service overview O P T I C A L D R I V E Optical Drive Device The illustration below shows the Optical Drive Device D E V I C E Hard Disk Drive H D D H D D The illustration below shows the 2.5” industry-standard HDD with 9.5mm height. B R A C K E T C P U HDD Bracket The illustration below shows the HDD Bracket that is placed over the HDD. CPU The illustration below shows the Intel Pentium-M CPU view.
service overview C P U T H E R M A L CPU Thermal Module The illustration below shows the thermal module for the CPU. It’s located on the top of CPU. M O D U L E M E M O R Y M O T H E R B O A R D Memory Module The illustration below shows the industry-standard 200pin SO-DIMM DDR SDRAM module for the notebook. Motherboard The illustration below shows the motherboard of the notebook.
service overview M O D E M M O D U L E W A L N M O D U L E T O P C A S E Modem Module The illustration below shows the modem module of the notebook. WALN Module The illustration below shows the WALN module of the notebook. Top Case The illustration below shows the TOP case of the notebook.
service overview Service Overview Please pay special attention to the cautions below to prevent any damages to the notebook and also please be sure to select the appropriate tools described in this section to perform any services desired. C A U T I O N S Precautions Before you perform any service and/or repair on the notebook, please follow the steps below first. 1. Be sure that the notebook is powered down. 2. Disconnect the AC plug from the notebook 3. Turn the notebook over.
service overview T O O L S Appropriate Tools The illustrations below show the appropriate tools that should be used for the notebook’s service and repair. C R O S S S C R E W - Phillips-head Screwdriver Use a Phillips-head screwdriver to fasten/remove the K- or B-typed screws.
Disassembly procedure 2 Chapter Disassembly Procedure Please follow the information provided in this section to perform the complete disassembly procedure of the notebook. Be sure to use proper tools described before. A SUS S62 Series Notebook consists of various modules. This chapter describes the procedures for the complete notebook disassembly. In addition, in between procedures, the detailed disassembly procedure of individual modules will be provided for your service needs.
Disassembly procedure B A T T E R Y Battery Module The illustration below shows how to remove the battery module. B A T T E R Y M O D U L E 1. Unlock and hold the latch No (1). R E M O V A L 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Disassembly procedure H D D M O D U L E H D D M O D U L E R E M O V A L HDD Module The illustrations below show how to remove the HDD module from the notebook. Removing HDD Module 1. Remove 3 screws (M2.5*4L (K)), then remove the HDD door. M2.5*4L 2. Lift the HDD module and then remove it. 3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing.
Disassembly procedure W I R E L E S S L A N M E M O R Y M O D U L E M E M O R Y R E M O V A L Wireless LAN Module The illustration below shows how to remove the Wireless LAN module. 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. 2. And open the two latches to pop the MINI PCI MODULE up then pull it out. Memory Module The S62 Series Notebook does not have RAM onboard. There is one SO-DIMM sockets for installing SO-DIMM RAM. It can upgrade the total memory size up to 1GB .
Disassembly procedure 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30°, then pull out the memory module in that angle (No. 3). 1 3 2 30o C P U M O D U L E CPU Module The illustrations below show how to remove the CPU module from the notebook. C P U R E M O V A L Removing CPU Module 1. Remove 2 screws (M2.5*4L (K)), then remove the CPU door. M2.5*4L 2. Remove 4 screws (M2*3L (K)) by order.
Disassembly procedure 3. Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take away the CPU thermal module. M2.5*4L 4. Turn the non-removable screw here 180 degrees counter-clockwise to loosen the CPU. L O Unlock 5. Squeeze the vacuum handling pump and use it to lift the CPU away.
Disassembly procedure O P T I C A L D R I V E ODD Module The illustration below shows how to remove the ODD module. D E V I C E 1. Remove 1 screw (M2.5*4L (K)). O D D R E M O V A L M2.5*4L 2. Push the ODD Module out by a pair of tweezers.
Disassembly procedure K E Y B O A R D K / B R E M O V A L Keyboard The illustration of below shows how to remove the keyboard. Removing Keyboard 1. Push the 4 latches in (No.1, No.2, No.3, No.4) with a pair of tweezers or a single-slotted screwdriver and lift the keyboard plate up. 1 2 3 4 2. Lay the keyboard down over the Top case. *Do not remove the keyboard yet. The keyboard cable is still attached. 3. Disconnect the FPC connector by a pair of tweezers.
Disassembly procedure C A B L E R E M O V A L Removing Keyboard Cable 1. Use a flexible connector tool to unlock the cable connector on both ends (no. 1). 2. Carefully pull out the keyboard cable (no. 2) with a pair of tweezers. 3. Lock the connector (no. 3) again to avoid possible breakage. 2. Cable out 1. Unlock 1. Unlock 3. 3. 4. Remove keyboard from the top case.
Disassembly procedure 2. Use a pair of tweezers to remove both hinge Cover. 3. Disconnect the LANCH cable and touchpad FFC on the top case. LANCH cable Touchpad FFC 4. Turn over the NB and remove 1 screws (M2*3L (K)).
Disassembly procedure 5. Disconnect the Coaxial & inverter cable. Coaxial cable Inverter cable 6. Arrange the Coaxial & inverter cable and antenna on the bottom case. B O T T O M 7. Remove 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) on the bottom case. C A S E R E M O V A L M2.5*4L M2.
Disassembly procedure 8. Before separate the bottom case, remove a little bit bottom case and let the cable and antennas through out of hole. Inverter & camera cable Antenna 9. Separate the bottom case from the top case. 10. Remove 2 screws (M2.5*6L (K)) on both hinge. M2.
Disassembly procedure 11. Separate the LCD module from the Top Case module T O P 12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board. C A S E R E M O V A L M2.5*4L 13. Remove the LANCH board cable.
Disassembly procedure 14. Disconnect the touch pad FFC and remove 1 piece of tape then take away the touch pad FFC. 15. Remove 5 screws (M2.5*4L (K)) and take away the touchpad bracket. M2.5*4L 16. Take away the touchpad.
Disassembly procedure M O T H E R B O A R D M O T H E R B O A R D R E M O V A L Motherboard The illustrations below show how to disassemble and remove the Motherboard. Removing Motherboard 1. Remove 2 screws (M2.5*4L (K)). 2. Remove 2 screws for CRT on the right side by a spacer screwdriver. 3. Separate the Motherboard from the bottom case. *Do not remove the Motherboard yet. The Bluetooth & Speaker cables are still attached.
Disassembly procedure 4. Disconnect the Bluetooth & Speaker cables then take away the Motherboard. Bluetooth cable Speaker cable 5. Remove 1 screw (M2*3L (K)) on the IO bracket. M2*3L 6. Use a single-slotted screwdriver to remove 2 screws HEX 5mm then take away the IO bracket.
Disassembly procedure 7. Remove 1 screw (M2*3L (K)) and take away the TPM board . M2*3L 8. Remove 4 pieces of tapes and disconnect the modem cable. 9. Remove 2 screws (M2*3L (K)) and take away the modem board.
Disassembly procedure B O T T O M C A S E M O D U L E B O T T O M C A S E Bottom Case Module The illustrations below show how to remove and disassemble the Bottom case module. The module contains Bluetooth board, speaker cable. Disassembling Bottom case Module 1. Disconnect the Bluetooth cable and remove it. D I S A S S E M B L Y 2. Take away the Bluetooth board from the bottom case. 3. Take away the speaker module from the bottom case.
Disassembly procedure L C D M O D U L E LCD Module The illustrations below show how to remove and disassemble the LCD module. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. L C D M O D U L E D I S A S S E M B L Y Disassembling LCD Module 4. Remove 7 rubber pads and 7 screws (M2.5 x 6L) from LCD module. M2.5*6L 5. Prying the inside edges of the LCD bezel, and then separates it from LCD back cover.
Disassembly procedure 6. Disconnect the LCD cable. 7. Remove 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) and take away the LCD panel. M2.5*4L M2.5*6L 5. Remove 4 screws(M2*3L(K)) on the right LCD bracket to disassemble the LCD bracket.
Disassembly procedure 6. Remove 4 screws(M2*3L(K)) on the left LCD bracket to disassemble the other LCD bracket. M2*3L 7. Remove 2 pieces of tapes and disconnect the coaxial cable then take it away. 8. Remove 1 screw (M2x 4L). .
Disassembly procedure 9. Lift a little bit the inverter board and disconnect the inverter cable and then take it away. 6. Remove 2 screws (M2x 6L) on both hinge and take them away. M2.5*6L M2.
Disassembly procedure 7. Disconnect the camera cable and remove the microphone. 8. Remove the cable and remove mylar then take away the cable. 9. Take away the Camera module from the LCD back cover. 10. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the wireless black wire.
Disassembly procedure 11. Remove 1 screw (M2x 4L) and remove 3 pieces of tapes then take away the wireless white wire.
Assembly procedure 3 Chapter Assembly Procedure Please follow the information provided in this section to perform the complete assembly procedure of the notebook. Be sure to use proper tools described before. A fter you have completed the previous chapter of complete disassembly, please follow this chapter to assemble the notebook back together. This chapter describes the procedures of the complete notebook assembly.
Assembly procedure L C D M O D U L E LCD Module The illustrations below show how to assemble and install the LCD module of the notebook. L C D M O D U L E A S S E M B L Y 1. Install the wireless white wire module and secure 1 screw (M2x 4L) then paste 3 pieces of tapes to secure it. 2. Install the wireless black wire module and secure 1 screw (M2x 4L) then paste 3 pieces of tapes to secure it. 3. Install the Camera module on the LCD back cover.
Assembly procedure 4. Install the microphone on the LCD cover and connect the camera cable. 5. Lay the inverter cable through the locking trench on the LCD back cover. 6. Lay the inverter cable through the locking trench on the LCD back cover.
Assembly procedure 7. Install the both hinge on LCD back cover and secure 2 screws (M2x 6L) to secure them. M2.5*6L M2.5*6L 8. Install the inverter board on LCD back cover and connect the inverter cable. 9. Secure 1 screw (M2x 4L) to secure it. .
Assembly procedure Assembly LCD Module 1. Connect the coaxial cable and paste 2 pieces of tapes to secure it. 2. Install the left LCD bracket and secure 4 screws (M2*3L (K)) to fix it. M2*3L 3. Install the right LCD bracket and 4 screws(M2*3L(K)) and secure 4 screws (M2*3L (K)) to fix it.
Assembly procedure 4. Install the LCD panel and secure 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) to secure it. M2.5*4L M2.5*6L 5. Connect the LCD cable. 6. Combine the LCD bezel and LCD Cover properly and press on all four edges until them snap into position.
Assembly procedure 7. Secure74 screws (M2.5 x 6L) on LCD front bezel then paste 7 rubber pads above. M2.5*6L B O T T O M C A S E M O D U L E B O T T O M C A S E A S S E M B L Y Bottom Case Module The illustrations below show how to assembly the Bottom case module. The module contains Bluetooth board, speaker cable. Assembling Bottom case Module 1. Install the speaker module on the bottom case.
Assembly procedure 2. Install the Bluetooth board on the bottom case. 3. Connect the Bluetooth cable and lay it through the locking trench on bottom case. M O T H E R B O A R D M O T H E R B O A R D Motherboard The illustrations below show how to assemble and install the motherboard of the notebook. 1. Install the modem board and secure 2 screws (M2.5*3L (K)).
Assembly procedure 2. Connect the modem cable and paste 4 pieces of tape to fix the cable. 3. Install the TPM board and secure 1 screw (M2*3L (K)) to secure it. M2*3L 4. Install the IO bracket and use a single-slotted screwdriver to secure 2 screws HEX 5mm.
Assembly procedure 5. Secure 1 screw (M2*3L (K)) on the IO bracket to secure it. M2*3L 6. Connect the Bluetooth & Speaker cables, before install the Motherboard to the bottom case. Bluetooth cable Speaker cable 7. Combine the Motherboard and the bottom case. 8. Remove 2 screws for CRT on the right side by a spacer screwdriver.
Assembly procedure 9. Secure 2 screws (M2.5*4L (K)) to secure the motherboard. Top Case Module T O P C A S E M O D U L E The illustrations below show how to assemble and install the top case module of the notebook. 1. Install the touchpad on the top case. T O P C A S E A S S E M B L Y 2. Install the touchpad bracket and secure 5 screws (M2.5*4L (K)) to secure it. M2.
Assembly procedure 3. Connect the touch pad FFC and paste 1 piece of tape. 4. Connect the LANCH board cable. 5. Install the LANCH board and secure 2 screws (M2.5*4L (K)). M2.
Assembly procedure 1. Combine the Top case module and LCD module. T O P C A S E M O D U L E A S S E M B L Y 2. Secure 2 screws (M2.5*6L (K)) to fix the hinge. M2.5*6L B O T T O M C A S E 1. Combine the bottom case from the top case.
Assembly procedure 2. Before secure the bottom case, let the cable and antennas through in the hole. Inverter & camera cable Antenna 3. Secure 15 screws (M2.5*6L (K)) and 1 screw (M2.5*4L) (K)) to secure the bottom case. M2.5*4L M2.5*6L 4.
Assembly procedure 5. Connect the Coaxial & inverter cable and lay the cables through the locking trench on bottom case. Coaxial cable Inverter cable 6. Secure 1 screws (M2*3L (K)) to secure cables. M2*3L I 7. Turn over the NB and connect the LANCH cable and touchpad FFC on top case.
Assembly procedure H I N G E C O V E R 8. Install the both hinge Cover. A S S E M A B L Y 9. Install the MIDDLE cover.
Assembly procedure K E Y B O A R D Assembling Keyboard The illustrations below show how to assemble and install the Keyboard of the notebook. K E Y B O A R D A S S E M B L Y 1. Place the Keyboard module on front side of the top case. Then connect Keyboard FPC Cable with a pair of tweezers. 2. Install Keyboard properly and note the lower side should inset first. Push the 4 latches to fix the keyboard.
Assembly procedure O D D M O D U L E ODD Module The illustrations below show how to assemble and install the ODD Module of the notebook. O D D 1. Insert the ODD module. 2. Secure 1 screw (M2.5*4L (K)) to secure it. M O D U L E I N S T A L L A T I O N M2.5*4L C P U M O D U L E CPU Module Assembly The illustration below shows how to install CPU and the CPU heat sink of the notebook. C P U I N S T A L L A T I O N 1. Squeeze the vacuum handling pump and use it to install the CPU.
Assembly procedure 2. Turn the non-removable screw here 180 degrees clockwise to lock the CPU. L O Lock 3. Install the CPU thernal module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order. 2 3 M2*3L 1 4 5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it. M2.
Assembly procedure Assembling Memory Module M E M O R Y M O D U L E The illustrations below show how to assemble and install the memory module to the notebook. 1. Insert the Memory module into the memory socket by an angle of 30 degree, and push down to latch the memory module. M E M O R Y I N S T A L L A T I O N 30o 2. Install the DIMM door and secure 2 screws (M2.5*4L (K)) to secure it. M2.
Assembly procedure 2. H D D M O D U L E H D D Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. HDD Module The illustrations below show how to assemble and install the HDD module of the notebook 1. Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing. I N S T A L L A T I O N M3*4L 2. Insert the HDD module to connect the FPC connector until it’s installed properly.
Assembly procedure 3. Install the bottom case and secure 3 screws (M2.5*4L(K)) to fix it. M2.5*4L B A T T E R Y M O D U L E B A T T E R Y Battery Module The illustrations below show how to install battery module of the notebook. 1. Install the battery module. Slide the battery latch to close the battery lock.
Upgrade & Replacement 4 Chapter Upgrade & Replacement Follow the individual procedures in this chapter to perform the notebook’s upgrade and replacement of various major components. A sus S62 Series Notebook is a 2 spindles product, which means there are less options for you to upgrade to. The key upgradeable and replaceable items include the CPU module, memory module, HDD module, and ODD module.
Upgrade & Replacement C P U CPU Upgrade The S62 Series Notebook comes standard with a Intel® Micro-FCPGA Socket on the motherboard, which means it can support all Intel Micro-FCPGA CPUs up to 2.13 GHz. Upgrading CPU Remove battery module 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Upgrade & Replacement Removing CPU Module C P U R E M O V A L 1. Remove 2 screws (M2.5*4L (K)), then remove the CPU door. M2.5*4L 2. Remove 4 screws (M2*3L (K)) by order. 2 3 M2*3L 1 3. 4 Disconnect the Fan cable and remove 2 screws (M2.5*4L (K)) then take away the CPU thermal module. M2.
Upgrade & Replacement 4. Turn the non-removable screw here 180 degrees counter-clockwise to loosen the CPU. L O Unlock 5. C P U I N S T A L L A T I O N Squeeze the vacuum handling pump and use it to lift the CPU away. Installing CPU The illustration below shows how to install CPU and the heat sink of the notebook. C P U I N S T A L L A T I O N 1. Squeeze the vacuum handling pump and use it to install the CPU. 2. Turn the non-removable screw here 180 degrees clockwise to lock the CPU.
Upgrade & Replacement 3. Install the CPU thermal module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order. 2 3 M2*3L 1 4 5. Install the CPU door and secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L Install battery module B A T T E R Y 1. Install the battery module. Slide the battery latch to close the battery lock.
Upgrade & Replacement M E M O R Y Second Memory Upgrade The S62 Series Notebook does not have RAM onboard. There are two SODIMM sockets for installing SO-DIMM RAM. It can upgrade the total memory size up to 1GB with a 512MB module on each socket. Upgrading Memory Module Remove battery module 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Upgrade & Replacement M E M O R Y R E M O V A L Removing Memory module 1. Remove 2 screws (M2.5*4L (K)), then remove the DIMM door. M2.5*4L 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30°, then pull out the memory module in that angle (No. 3). 1 3 30 2 o Installing Memory Module M E M O R Y I N S T A L L A T I O N 1. Insert the Memory module into the memory socket by an angle of 30 degree, and push down to latch the memory module.
Upgrade & Replacement 2. Install the DIMM door and secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L Install battery module B A T T E R Y 3. Install the battery module. Slide the battery latch to close the battery lock.
Upgrade & Replacement H D D HDD Upgrade The S62 Series Notebook uses an industry-standard 2½” HDD with IDE interface. You can replace the HDD to any capacity of your choice within our approval and prior test. Upgrading HDD Remove battery module 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Upgrade & Replacement H D D M O D U L E Removing HDD Module 1. Remove 3 screws (M2.5*4L (K)), then remove the HDD door. R E M O V A L M2.5*4L 2. Lift the HDD module and then remove it. 3. Remove 4 screws [M3 * 4(L)] to separate HDD from HDD housing.
Upgrade & Replacement Installing new HDD module H D D 4. Secure 4 screws [M3 * 4(L)] to fix HDD into HDD housing. I N S T A L L A T I O N M3*4L 5. Insert the HDD module to connect the FPC connector until it’s installed properly. 6. Install the bottom case and secure 3 screws (M2.5*4L(K)) to fix it. M2.5*4L Install battery module B A T T E R Y 7. Install the battery module. Slide the battery latch to close the battery lock.
Upgrade & Replacement W I R E L E S S L A N W A L N Wireless LAN Module The illustration below shows how to remove the Wireless LAN module. Replacing WLAN Remove battery module 1. Unlock and hold the latch No (1). R E M O V A L 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Upgrade & Replacement Removing WALN Module O D D 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. 2. And open the two latches to pop the MINI PCI MODULE up then pull it out. R E M O V A L W A L N M O D U L E I N S T A L L A T I O N Installing new WALN module 3. Install the MINI PCI module into the socket by an angle of 30 degree, and push down to latch the MINI PCI module.
Upgrade & Replacement 4. Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. Install battery module B A T T E R Y 1. Install the battery module. Slide the battery latch to close the battery lock.
Upgrade & Replacement O D D ODD Replacement The S62 Series Notebook can support DVD-ROM (8x DVD), COMBO (CD-R 24x/ CD-RW 24x / DVD-ROM 8x/ CD 24x), and DVD-Dual (DVD-R/RW: 4x/2x, DVD+R/RW: 4x/2.4x, CD-R/RW: 24x/ 10x, DVD: 8x, CD: 24x). Replacing ODD O D D Remove battery module 1. Unlock and hold the latch No (1). R E M O V A L 1 2. Slide the battery lock (No.2) and pull the battery pack out. 2 3. Pull the battery pack out.
Upgrade & Replacement Removing ODD Module 1. Remove 1 screw (M2.5*4L (K)). O D D R E M O V A L M2.5*4L 2. Push the ODD Module out by a pair of tweezers. Installing new ODD module 3. O D D Insert the ODD module.
Upgrade & Replacement 4. Secure 1 screw (M2.5*4L (K)) to secure it. M2.5*4L Install battery module B A T T E R Y 5. Install the battery module. Slide the battery latch to close the battery lock.
HARDWARE SPECIFICATION 5 Chapter Hardware Specifications You can enjoy and utilize the S62 series Notebook more effectively with a better comprehension of detailed hardware specifications of the notebook. T his chapter lists the detailed specifications of the notebook’s main system and modules. Please refer to this section when you need to find out specific technical data about the notebook.
HARDWARE SPECIFICATION 1 MARKETING SPEC S62 Specification Product Family Dimension Weight Color CPU Type Speed Package L2 Cache Size Memory Type Base Memory Expansion Memory MAX LCD Size S62 328 x 288x 27-38mm 2.4 Silver-Gray Intel Yonah 1M/2M 1.66G,1.83G,2.0G,2.16G Micro-PGA 479M 2M None 256/512MB/1GB 2GB 14.
HARDWARE SPECIFICATION North Bridge INTEL 945GM South Bridge INTEL ICH7M Super IO SMSC LPC47N217 Thermal Sensor ADT7461ARMZ Micro-Processor ITE8510E KBC ITE8510E Flash ROM (ISA) Graphic Accelerator 3D Controller SST Intel 950 internal GPU Yes Intel Internal graphic AGP Support No Dual view/Dual App Yes Graphic Memory TV Out Support 4Mb Share Memory Yes PCMCIA Slot Type Type II x 1 Controller RICOH R5C841 Card Bus Yes ZV port No Sound System Controller AD1986A SW wave table Y
HARDWARE SPECIFICATION Spec I/F 56K Azalia MDC Jack RJ-11 ACPI Yes V.90 Yes Voice Phone No Digital Line Protection Yes Wake On Ring Yes BT RJ-11 port No Controller CSR I/F USB ANT BT-183 Chip antenna LAN Jack Wake On LAN Controller RJ-45 RJ-45 port YES RealTEK RTL8110SB Internal Keyboard Vendor Key 88 Keys (W/ MS-Windows function keys) Stroke/Pitch - Function Key 12 Function Keys Hot Key Function 10 Hot Keys Suspend (STR or STD) Fn + F1 RF enable Fn + F2 802.
HARDWARE SPECIFICATION PC Speaker Volume Fn + F11 Number Lock Fn + Ins Scroll Lock Fn + Del Volume decrease Instant Keys Power Saving Power 4 Gear E-mail Direct button Internet Browser Direct button Disable TouchPad Direct button Status Indication 8 LEDs (Machine Base x 8) Power Status Yes (Green on LED when Power on. Blinking when in SUSPEND mode. OFF when power off.) Battery Charge Status Yes (Orange when charging. Blinking when battery low. OFF when fully charged/empty.
HARDWARE SPECIFICATION Reset/Force Off I/O Port Yes (Force Off switch) All ports support hot-plug Parallel NO CRT Yes Port Bar port III Yes Mouse/Keyboard NO IrDA Port NO Fax/Modem Yes RJ11 LAN Jack Yes RJ45 Line In NO Mic In Jack Yes Mono Head Phone Jack Yes Stereo out USB port Yes 4 Ports DC-In Yes 2-pin type/65W 15-pin D-sub Heat Solution Heat Pipe Yes Heat Sink Yes FAN Support Yes AC Adaptor Delta/Liteon Input AC 100-240Volt, 50~60Hz Output DC 19V, 3.
HARDWARE SPECIFICATION PM On Power Management TBD. AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.1 Yes Password overridden by Master password DTS/Thermal diode Security Password Security Lock TPM Kensington Lock Hole Infineon TPM 1.
HARDWARE SPECIFICATION LAN Port Yes 5- 8
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.1 CPU Processor Type: Intel Yonah Processor Processor frequency: 1.66 /1.83 /2.0/2.16 GHz Construction method: u-PGA479 with socket Supply voltage: Code:1.25V(High_Frequency_Mode)~0.725V(lowest_Freque ncy_Mode) Function feature: On-die , primary 32-KB instruction cache and 32-KB writeback data cache. On-die , 2MB second level cache with Advanced Transfer Cache Architecture. Data Prefetch. Streaming SIMD extensions 2(SSE2).
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.2 2.2.1 CHIPSET North Bridge Function: Full support 32bits AGTL+ host bus addressing Supports 400/533/667 DDR2 device Integrates the graphic controller Support Intel Rapid Memory power management DMI x2/x4 Interface connect to ICH 2.2.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: Two 200 pin SO-DIMM socket 64-bit data path 1.8V Functional features: Hardware features: Parity support: 2.4 Supports up to 16 simultaneous open pages Supports DDR2 400/533/667 DDR devices Maximum of 2GB of system memory without ECC BIOS ROM ROM Type: SST Flash Memory Package: 32-Lead PLCC Supply voltage: 3.3V Serviceability: End user upgradeable for the firmware 2.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.6 I/O INTERFACE Controller Function: Full ACPI 1.0 and PC98/99 compliant Support 10 options IRQ channel Integrated PC/AT Floppy Disk Controller Support 5.25”/3.5”/2.5” FDD Support 3-mode FDD Integrated Serial Port 232C Controller RS- Integrated Infrared Controller Support IrDA 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.7 PCMCIA Controller Function: PC99, ACPI 1.0 and PCI bus management 1.1 Design compliant power Integrated PC Card Controller Support 1995 PC Card (PCMCIA 2.2) Integrated Card Bus Controller PC98/99/2001 compliant Single Chip PCI-CardBus/1394 Bridge Compliant with PCI Specification2.2 1394 PHY 1394 OHCI-LINK Bridge Flash Memory Interface (3 in 1 Media Bay) 2.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2.9 AUDIO CODEC Function features: Fully Compliant HD Audio Compliant. 20-bit Stereo Digital to Analog Converters. 18-bit Stereo Analog to Digital Converters. High-quality pseudo-Differential CD input. Meets or exceeds the Microsoft PC99 Audio Performance requirements. S/PDIF digital audio output. 3D Stereo Enhancement. Vendor: Parts Number: Package: ADI 1986A 48-pin LFCSP 2.10 AUDIO AMPLIFIER Function features: 2 X 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Vendor: Parts Number: Package: Realtek RTL8110SB 128-Pin LQFP 2.11.2 MODEM Function features: V.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3 KEY PARTS LIST Key Parts Summary: S62 Project Keyparts List Priority Vendor Model No. ASUS Part No. CPU Intel INT CO667 DC 2.16G T2600 L8VN Intel INT CO667 DC 2.0G T2500 L8VP Intel INT CO667 DC 1.83G T2400 L8VQ Intel INT CO667 DC 1.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3.1 Display WXGA Technology: Active color (TFT: Thin Film Transistor) Size: 14.1”W Resolution: WXGA (1280 X 800) Dimension: Pixel Pitch: 0.279mm x 0.279mm Display Colors: 262,144 Vendor: AUO/CMO/Hansstar WXGA Technology: + Active color (TFT: Thin Film Transistor) Size: 14.1”W Resolution: WXGA+ (1440 X 900) Dimension: 3.2 Pixel Pitch: 0.297mm x 0.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Hardware features: Standard I/O addresses: 1F0h to 1F7h and 3F6h Support of minimum IRQ 14 Support of at least 3 DMA channels, if DMA is supported Easily removable and exchangeable for user’s future upgrade Vendor/Model: HGST/ HTS421260H9AT00 , HTS421280H9AT00 3.3 Combo Drive Form factor: 5.25 Inch Speed: 24X/24X/8X/24X Height: 12.7mm Interface: IDE (ATAPI) Functional features: Power Management APM 1.1 and 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3.5 Touch Pad Dimensions: 65 mm(W) x 49 mm(H) x 2.82 mm(T) Sensor effective areas: 62.5 mm(W) x 46.5 mm(H) Interface: PS/2 X/Y position resolution: 40 points / mm (graphics mode) Customizing: Custom color can be printed on the sensor pad.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3.7.2 Chemistry: Li-ion rechargeable battery Voltage: Nominal 11.1V (= 3.7V cell 3pcs in serial, 2pcs in parallel) Capacity: 2400mAH/Cell Vendor: Celxpert Duration: Minimum 4 hour (w/o PMU) Charge Method: Fast Charge: 2.5A, 3.0 hour (while System off) Charging Source: AC Adapter Gas-gauge: BENCHMARQ bq2060H RTC Backup Battery Purpose: Backup the RTC/CMOS data While AC adapter off & Main Battery removed 3.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Regulatory: EMI: FCC Class B Safety: CISPR 22 Class B .Dimension: (L) 114.5 x (W) 49.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4 4.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.3 4.3.1 4.3.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4.3.3 PCI INT Map INT Description INTA Giga LAN Chip INTB CARDBUS, 1394, INTC INTD 4.3.4 PCI Bus Master Map REQ Description REQ0 CARDBUS, 1394 REQ1 4.3.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION .CRT Display (Analog) HDD ODD LCD KEYBOARD TOUCHPAD&LED 1ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-In .FAN .INVERTER .MDC .1394 .USB Universal Serial Bus Port Bar 3 USB, CRT, Parallel Port, RJ-45 LAN & Modem .Card Reader TV OUT 5.1 CRT Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 3 BLUE Video (analog) Blue this DAC analog output drives the CRT interface. 4 MONITOR ID Bit 2 NC 5 GROUND Ground 6 RED Return (ground) Ground 7 GREEN Return (ground) Ground 8 BLUE Return (ground) Ground 9 KEY NC 10 SYNC Return (ground) Ground 11 MONITOR ID Bit 0 NC 12 MONITOR ID Bit 1 DDC monitor data 13 HSYNC CRT Horizontal Sync this output is The Horizontal sync pulse for the CRT Monitor.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.2 Hard disk pin assignment Vendor ALLTOP Part No. Pin No. 44 Pin (SMT) C17851-144A1-L No.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 13. IDE_PDD4 14. IDE_PDD12 15. IDE_PDD3 16. IDE_PDD13 17. IDE_PDD2 18. IDE_PDD14 19. IDE_PDD1 20. IDE_PDD15 21. IDE_PDD0 22. IDE_PDDREQ 23. GND 24. IDE_PDIOR# 25. IDE_PDIOW# 26. GND 27. IDE_PIORDY 28. IDE_PDDACK# 29. INT_IRQ15# 30. IDE_PIOCS16# 31. IDE_PDA1 32. IDE_PPDIAG# 33. IDE_PDA0 34. IDE_PDA2 35. IDE_PDCS1# 36. IDE_PDCS3# 37. IDE_PDASP# 38. +V5S_IDE 39. +5VS_IDE 40. +V5S_IDE 41. +5VS_IDE 42. +V5S_IDE 43.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.4 LCD pin assignment Vendor Part No. Pin No. ENTERY 3761-Q30C-01R 30 Pin (SMT) No.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.5 Internal keyboard pin assignment Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 26 KEYDETECT0 Keyboard ID bit 0 27 GND Ground 28 KEYDETECT1 Keyboard ID bit 1 5.6 I GND I Internal Touch Pad Pin assignment Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.7 1ST Battery pin assignment No Signal Description Type 1 BAT_CON Battery input/output voltage P 2 BAT_CON Battery input/output voltage P 3 BAT1_CNT1# NVDC control pin 1 I 4 BAT1_CNT2# NVDC control pin 2 I 5 SMCLK_BAT SMB Bus Clock I/O 6 SMDATA_BAT SMB Bus DATA I/O 7 TS# Thermal Pin O 8 GND Ground P 9 GND Ground P 5.8 DC in Jack pin assignment Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 2 INTSPKR- Internal speaker left sound negative O 3 INTSPKL+ Internal speaker signal channel positive O 4 INTSPKL- Internal speaker left sound negative O 5.9.2 Headphone Jack Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 5.10 Fan Pin Assignment Vendor Part No. Pin No. ACES 85205-03701 3 Pin (SMT) No Signal Description Type 1 +5VS_FAN 5V Power Supply P 2 FANSP1 FAN speed signal input I 3 GND Ground P 5.11 Inverter pin assignment Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 17 18 19 20 GND Ground P INTMIC_A_GND Audio Ground P GND Ground P INVMIC_A Internal MIC I *** 5.12 MDC signal Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 4 LTPA0+ Twisted-pair cable A positive I/O 5.14 USB pin assignment Vendor Part No. Pin No.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 12 MS_CD 13 MS_DATA3 14 SD_CMD 15 MS_SCLK 16 MS_VCC 17 SD_DAT3 18 GND 19 SD_DAT2 20 SD_WP 21 SD_CD 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Devices +12V SUSC# Control +5V SUSC# PCMCIA Slot 5V, USB +3.3V SUSC# NB, DDR, PCMCIA Controller, PCMCIA Slot 3.3V, Keyboard Controller +2.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.2 Power management mode 6.2.1 Full-On mode All system devices are not power managed and the system can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slow down but all other devices are full on. 6.2.3 Stand by mode A suspend state where all motherboard components are still powered-on except for the system clock generator device. The PCI and CPU buses are driven to the inactive idle state.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 IRQ 1-15 Stand by Stand by Time out Predefined Memory/IO range access Stand by hot key pressed Battery Warning Battery Low Ring Indicator Keystroke Mouse movement Schedule Alarm STR STD Suspend Time out Power Button STR hot key pressed Ring Indicator Suspend button Keystroke (Int.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.3.1 Lid switch Display mode State Lid close Lid open LCD Full on LCD OFF No action Stand by LCD OFF No action STR/STD LCD OFF No action Full on No action No action Stand by No action No action STR/STD No action No action Full on LCD OFF/CRT ON No action Stand by No action No action STR/STD No action No action CRT SIMUL LCD display will be shut down while closing LCD. 6.3.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 6.4.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the following PCB assembly and modules. 7.1.1 7.2 Board assembly Processor Upgradeable CPU (u-PGA 479) Main Board Main System board Inverter Board LCD Module Back-light TOUCH PAD 5 LED Indicators, 2 Touch Pad Button SO-DIMM Module Memory Expansion Modem Board MDC Processor Feature: Intel Yonah processor with on-die L2 cache.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.3 7.3.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.3.2 DC/DC module spec Controller: MAX1987, TPS5130, LTC3728, TL494 Input voltage: 8-20V Output voltage/current: Voltage Current Ripple Regulation +5V/+5VS 4.5A 75mV +-3% +3.3V/+3.3VS 4.5A 75mV +-3% +12V/+12VS 150mA 200mV +-5% +3VALWAYS 50mA 75mV +-5% +1.5VALWAYS 50mA 75mV +-5% +5VSUS 50mA 75mV +-5% +v1.8/+V1.8S 1A 75mV +-3% +VCCP 1A 75mV +-3% +V1.2S 2A 75mV +-3% VCORE 22A 75mV +-3% +2.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Input: Adapter Contain Min Typ. Charge current (3S3P) Charge current (3S2P) Ripple & Noise 500mV Efficiency 90% 7.4 Inverter Board Inverter spec Input voltage: 12~20V Output current: 6.5mA(max) Start voltage: 1500Vrms(min) Efficiency: 80%(min) Brightness adjusted by input voltage.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.5 7.5.1 Adapter spec Input Input voltage: 90~240VAC, Full range Input frequency: 47~63Hz Input current: 1.5A(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/240VAC Efficiency: 80%(min) 7.5.2 Output 65W power output Output Voltage/Current: 18.05~19.95V/3.42A Ripple: 500mV 7.5.3 Protection OVP: 24V(max) SCP: Yes OCP: 19V/5A(max) 7.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 7.7 LAN Spec Controller: REALTEK RTL8110SB Interface: PCI Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LAN during S3,S4 Integrated IEEE 802.3x 10BASE-T and 100 BASE-TX and Giga LAN compatible PHY and transceiver in one chip Full duplex and half duplex support at both 10, 100M and 1000Mbps Low power 3.3V device 128-Pin LQFP package 7.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 8 8.1 MISCELLANEOUS Indicators Power LED Feature: Show System power status Type: 5ψLED Color: Green Indication: On: System in ON Mode Flash (0.3Hz): System in SUSPEND Mode Off: System in OFF Mode Location: On board Charging LED Feature: Show Battery status Type: 5ψLED Color: Orange Indication: On: Battery in Charging Flash (0.
S62 series Hardware Technical Specification Rev. 1.
S62 series Hardware Technical Specification Rev. 1.0 06/04/20 Europe P-CORD 1.8m 250V 2.5A EUR 2-PIN WS-027-T Well shin Austria P-CORD 1.8m 250V 2.5A AUS 2-PIN WS-027-T Well shin South Asia P-CORD 1.8m 125V 7A WS016+WS027 WS-027-T Well shin 8.3 Safety/ EMI Appliance (TBD): Agency Approval EMC CE Mark (Europe) BCIQ (Taiwan) Other Requirements EMI FCC Class B Certified (USA & Canada), VCCI (Japan) Safety UL, CSA or CUL, NEMKO-CB (Norway), TUV, CE Mark (Europe) Telecomm.
BIOS SPECIFICATION 6 Chapter Software Specifications Get to know more about the S62 series Notebook with a detailed look at the software specifications. T he information contained in the chapter can be quite useful when you are troubleshooting the system’s hardware. Each item has its individual usage for you to understand the software side of the notebook’s architecture.
BIOS SPECIFICATION 1. General Description The specification is a guideline for BIOS development on S62 series platform. Anyone who needs the information of system BIOS can read it for reference. The general device specification, SMBUS, PCI Devices IRQ Routing Table, GPIO pins definition and so on are subjected to be depicted in this document. Hotkeys implementation and other BIOS features are also included in. S62 series is an IBM PC/AT compatible notebook PC.
BIOS SPECIFICATION 2. Summary of Hardware Configuration 2.1 KEY COMPONENTS LIST The key components used on S62 series are listed below. Table 2-1 Key components Item CPU North Bridge South Bridge VGA Audio Audio Codec USB LAN Modem Modem Codec Cardbus IEEE1394 Clock Gen. Thermal KBC Super I/O CMOS CAM Blue tooth Wireless Vendor Intel Intel Intel Intel Intel Realtek Intel Realtek Intel Conexant Ricoh Ricoh ICS ADI ITE SMSC Vimicro ASUS INTEL Part’s Name Yonah 1.6G/1.8G/2.0G/2.
BIOS SPECIFICATION One IEEE 1394 B Type Jack One PCMCIA One Memory card reader(SD/MMC/MS) Power Supply AC adapter : Output : 19 VDC, 3.42A, 65W, Input : 100~240V AC, 50/60Hz universal Battery Pack : Main : Li-Ion 6 cells, 14.8V, 4800mAh, 65W battery pack Run-down life 5.5hrs Charging time, 2hrs Quick charge 90% (Power off) / 4hrs (Power on) Battery low will enable the Power Management System under Windows environment. Enters Save-To-Disk mode automatically if less than 5% 2.
BIOS SPECIFICATION USB1 USB2 USB3 USB2.0 PCI2PCI Bridge LPC Bridge IDE Controller SMBus Controller PCIE(802.
BIOS SPECIFICATION 3. Summary of BIOS Requirements Item BIOS Vendor Revision Implemented Specification Supported Operating System (O.S.) Boot Block Crisis Recovery BIOS Update CPU DRAM Cache Security Display Floppy Drive Hard Disk Multiple Boot Plug and Play ACPI SpeedStep(Geyserville III) PXE Battery AC Power Keyboard/Mouse PCI / AMC’97 Device Power Management Description AMI 8.0 PCI Express 1.0, ACPI 1.0b/2.0, PCI BIOS 2.0, PnP 1.0a, SMBIOS (DMI) 2.3.3, SMBus BIOS 1.0, PXE 2.
BIOS SPECIFICATION 4. BIOS Features 4.1 SYSTEM SECURITY The functions of all passwords are listed in following table. Table 4-1 Password Function Function Password User Supervisor Hard Disk Access all setup items V Access only part of setup items V Enter system V Unlock a hard disk V Disable “lock” of a hard disk V Here are some other rules should be followed: If supervisor password is enabled, BIOS allows supervisor setting the authority level of the user password.
BIOS SPECIFICATION The configuration index/data I/O ports are 2Eh/2Fh. And only Parallel Port function is enabled by BIOS. The Parallel Port Mode can be adjusted in BIOS SETUP MENU during POST. Table 4.4 shows all modes supported by BIOS. Table 4.4 Parallel Port Mode supported by BIOS Parallel Port Mode 1 SPP/Bi-Directional 2 EPP/SPP 3 ECP 4 ECP/EPP 4.5 RESOURCE ALLOCATION The system resources are allocated as follows at POST.
BIOS SPECIFICATION LAN Controller Dynamic D800~D8FF IRQ16 Wireless (802.11abg) Static IRQ17 Ricoh MS Dynamic IRQ19 Ricoh SD Dynamic IRQ19 FE8FEC00~ FE8FECFF FDFFF000~ FDFFFFFF FE8FF000~ FE8FF0FF FE8FF400~ FE8FF4FF Note: The resources of dynamic devices will be changed if users change the settings. The IRQ 9 is reserved for SCI of ACPI O.S. 4.
BIOS SPECIFICATION Power Scheme Home/office Desk Portable/Laptop Presentation Always On Minimal Power Management Max Battery AC Power None Adaptive Adaptive None Adaptive Adaptive DC Power Adaptive Adaptive Degrade None Adaptive Degrade Three control methods that are implemented to support Windows XP Native Processor Performance Control. _PCT Processor performance control object. _PSS The number of supported processor performance states.
BIOS SPECIFICATION THRM Throttle On 95 Threshold THRM Throttle Off 90 Threshold Fan Failure Temp Point 65 Fan Stop Threshold 50 STEP Trip Point 1 55 STEP Trip Point 2 60 STEP Trip Point 3 65 STEP Trip Point 4 70 STEP Trip Point 5 75 STEP Trip Point 6 80 STEP Trip Point 7 85 STEP Trip Point 8 90 Fan Full Run Threshold 95 STEP Trip Pointer 1 3 Hysteresis Offset STEP Trip Pointer 2 3 Hysteresis Offset STEP Trip Pointer 3 3 Hysteresis Offset STEP Trip Pointer 4 3 Hysteresis Offset STEP Trip Pointer 5 3 Hysteres
BIOS SPECIFICATION 4.8 NUMERIC PAD CONTROL There is a control switch in setup menu item for enabling or disabling numeric pad lock of an internal keyboard. 4.9 TOUCH PAD CONTROL In ACPI environment, BIOS will notify ATK0100 to enable/disable Touch Pad when the Touch Pad Enable/Disable instant key is pressed. 4.10 HOTKEY USAGE DURING POST The hot keys used during POST are: Hotkey Description 1 TAB Switch from “LOGO” screen to “message” screen, i.e.
BIOS SPECIFICATION 5. GPIO Pin Assignment The following tables are the definition of GPIO pins. Some of GPIO pins need to be initialized by system BIOS and some of them need the driver to support. Please check the Description column for reference. Table 5-1.
BIOS SPECIFICATION 41 42 43 44 45 46 47 48 49 N/A N/A N/A N/A N/A N/A N/A O O GPIO41 GPIO42 GPIO43 GPIO44 GPIO45 GPIO46 GPIO47 GPIO48/GNT4# CPUPWRGD N/A N/A N/A N/A N/A N/A N/A GNT4# H_PWRGD 1. Power field: M -> main power will, R-> resume power well 2. pins in light gray: used as Native Function pins 3.
BIOS SPECIFICATION Port I/O Input Pin Type Pull-up/down A.0 O A.1 A.2 O A.3 A.4 O A.5 O A.6 O A.7 B.0 B.1 B.2 B.3 B.4 B.5 B.6 B.7 O O O O A A O O O C.0 C.1 C.2 C.3 C.4 C.5 C.6 C.7 D.0 D.1 D.2 D.3 D.4 D.5 D.6 D.7 E.0 E.1 E.2 E.3 E.4 E.5 E.6 E.7 F.0 F.1 F.2 F.3 F.4 F.5 F.6 F.7 A A O A O A I I A O A I I I I A Pull-Up Pull-Up Pull-Up Pull-Up I O O A A I Pull-Up Table 5-2.
BIOS SPECIFICATION G.0 G.1 G.2 G.3 G.4 G.5 G.6 G.7 H.0 H.1 H.2 H.3 H.4 H.5 H.6 H.
BIOS SPECIFICATION PIN# GPI I/O Type O 23 24 25 27 28 29 30 31 32 33 34 35 36 40 40 41 42 43 44 45 46 47 10 11 12 13 14 23 I I I I I I I I I I O I I I Table 5-3. Super I/O GPIO Definition Name Activat Description ed Level NC NC N/A NC NC N/A NC NC N/A NC NC N/A NC NC N/A NC NC N/A NC NC N/A NC NC N/A NC NC N/A N/A NC N/A SIOSMI# Low N/A NC NC N/A NC NC N/A NC NC N/A * : NC -> Not Connected, SI -> Selection ID.
BIOS SPECIFICATION 6. Devices 6.0 CPU The CPU supported by S62 series system is Intel mobile Yonah dual core processor. The supported frequency is from 1.66GHz to 2.16GHz. 6.1 NORTH BRIDGE (CALISTOGA) 6.1.1 DRB Registers (dram row boundary registers) The DRAM Row Boundary Register defines the upper boundary address of each pair of DRAM rows with granularity of 128MB. The offset of these registers are 100h~103h. The following is the mapping of the registers.
BIOS SPECIFICATION 001 -> 010 -> 011 -> 100 -> 101 -> 110 -> 111 -> IRQ10 IRQ11 Reserved IRQ20(Only available if APIC enabled) IRQ21(Only available if APIC enabled) IRQ22(Only available if APIC enabled) IRQ23(Only available if APIC enabled) 6.2.2.2.
BIOS SPECIFICATION 6.2.3 IDE Controller 6.2.3.1 Function and Feature The ICH7-M IDE controller features two sets of interface signals(Primary and Secondary) that can be independently enabled, tri-stated or driven low. The ICH7-M IDE controller supports both legacy mode and native mode IDE interface. In native mode, the IDE controller is a fully PCI compliant software interface and does not use any legacy I/O or interrupt resources.
BIOS SPECIFICATION same register, causing the USB 1.1 controller to see a connect event and the EHC to see an ‘electrical’ disconnect event. The UHCI driver and hardware handle the connection and initialization process from that point on. The EHCI driver and hardware handle the perceived disconnect. 4. Configure Flag = 1 and an USB 2.0-capable Device is connected - In this case, the USB 2.0 Controller is the owner of the port before, and remains the owner after, the connection occurred.
BIOS SPECIFICATION 7. CMOS Setup Utility S62 series system BIOS allows users to change some system hardware/function settings during POST (power on self test) stage, users may hit F2 key to enter SETUP mode in POST, the setup feature is categorized into 7 menus described as below: 7.1 MAIN MENU 7.1.1 Main menu: Main menu describes system overall information with some user changeable setting, it contains below items: AMI BIOS: 1. Version:[xxxx.xxx] -> Current system BIOS version 2. VGA BIOS Version:[xxxx.
BIOS SPECIFICATION 7.2 ADVANCED MENU: In advanced menu, users can configure I/O device resource such as I/O base, interrupt vector or DMA(Direct Memory Access) channel, some auxiliary settings may be changed as well. Detailed I/O device settings are described below: Core Multi-Processing:[Enable] -> enable/disable dual core function Execute Disable Bit:[Enable] -> enable/disable “Execute Disable” function IDE configuration: See 7.2.1 Super I/O configuration: See 7.2.
BIOS SPECIFICATION 7.2.1 IDE Configuration: 7.2.1.1 Primary Master/Slave IDE At system boot, the Intel Ultra ATA Storage Driver configures each ATA/ATAPI device to transfer data at particular transfer modes. These transfer modes are defined by ATA standards, and are either Programmed I/O (PIO) or Direct Memory Access (DMA or UltraDMA) type transfers.
BIOS SPECIFICATION 7.2.2 SuperIO Configuration: Users can enable/disable Parallel port function and set Parallel Port mode in this page. The Parallel Port modes supported by this system are listed below. 1. 2. 3. 4.
BIOS SPECIFICATION 7.3 SECURITY MENU: BIOS supports two levels of password for security protection: Supervisor password: Users may set, change or erase system password, the password data is saved in non-volatile device (CMOS), system password check is done during POST(Power On Self Test). The BIOS will prompt a dialog message to ask user for password check when: The system has password stored, and “Password on boot” setting in BIOS SETUP is enabled.
BIOS SPECIFICATION 7.4 POWER MENU: LCD Power Saving: LCD exhausts the most part of power while the system is operating. S1A notebook system BIOS support auto backlight saving mode. When the system BIOS detects AC adapter removal, the LCD brightness is tuned down to 80﹪of its original setting, and back to normal when AC adapter is back inserted.
BIOS SPECIFICATION 7.5 BOOT MENU: In this menu users can decide the boot sequence, as long as the device with highest boot priority exists, system BIOS will boot from it, device boot priority is adjusted by pressing “+”,”-“ or space key on the selected (highlighted) item.
BIOS SPECIFICATION 7.
BIOS SPECIFICATION 8. BIOS Flash Utility There are two utilities for updating S62 series BIOS. One is DOS mode utility and the other is Windows mode utility. The detailed information is in Table 8-1. Table 8-1: BIOS Flash Utilities Utility Name Supported OS Aflash2 DOS Winflash Windows Revision 2.10 and later 2.
BIOS SPECIFICATION 9. Embedded Controller (EC) 9.1 HOTKEYS S62 series supported Fn+Hotkeys are listed in following table. Table 9-1 Fn+Hotkey Table Fn+ Legacy Hotkey Function Fn+F1 N/A Hotkey ACPI Description SCI Fn+F2 N/A SCI Fn+F3 Fn+F4 N/A N/A N/A SCI Fn+F5 SMI SCI Fn+F6 SMI SCI Fn+F7 Fn+F8 Fn+F9 Fn+F10 Fn+F11 SMI SMI N/A SMI SMI SCI SCI N/A SCI SCI Fn+F12 SMI SCI Standby In ACPI OS, user needs to set sleep button behavior to “Standby” in property of Power Option.
BIOS SPECIFICATION When pressing Internet instant key, BIOS will notify ATK to launch Internet browser application. 9.3.3 Email Key When pressing Email instant key, BIOS will notify ATK to launch email application. 9.3.5 Touch Pad Enable/Disable Key When pressing Touch Pad Enable/Disable instant key, BIOS will notify ATK to enable/disable Touch Pad. 9.3.4 Power4 Gear Key When pressing Power4 Gear instant key, BIOS will notify ATK to switch system power scheme.