User's Manual

Intel
®
Wireless-AC 9560 (Jefferson Peak)
April 2017 External Product Specification (EPS)
Document Number: 567240–1.0 Intel Confidential 3
Contents
1 Introduction ................................................................................................................. 8
1.1 Key features ........................................................................................................ 8
1.2 Jefferson Peak module SKUs ................................................................................. 10
2 Product Architecture ................................................................................................... 11
2.1 Integrated Connectivity concept ............................................................................ 11
2.1.1 MAC-PHY split .................................................................................... 11
2.1.2 SoC and Companion RF compatibility ..................................................... 11
2.1.3 Swappable Companion RF/Discrete ....................................................... 12
2.2 Jefferson Peak interfaces ...................................................................................... 12
3 Electrical Specifications .............................................................................................. 14
3.1 2230 and 1216 form factor pinouts ........................................................................ 14
3.2 Input/output electrical specifications ...................................................................... 22
3.3 Peak current consumption .................................................................................... 24
3.4 M.2 power and ripple limits ................................................................................... 24
3.4.1 Power supply ripples ........................................................................... 24
3.4.2 Platform state transitions ..................................................................... 25
3.5 M.2 ground (GND) ............................................................................................... 25
4 Mechanical Specifications ........................................................................................... 26
4.1 Weight ............................................................................................................... 26
4.2 M.2 2230 mechanical specification ......................................................................... 26
4.3 M.2 1216 mechanical specification ......................................................................... 27
4.4 Z height ............................................................................................................. 29
4.5 M.2 antenna retention .......................................................................................... 29
4.5.1 Recommended method for retention of M.2 cable.................................... 29
5 Performance ............................................................................................................... 30
5.1 Power consumption .............................................................................................. 30
5.1.1 Wi-Fi power consumption ..................................................................... 30
5.1.2 BT power consumption ........................................................................ 31
5.2 Wi-Fi performance ............................................................................................... 32
5.2.1 Wi-Fi Tx power (TBD) .......................................................................... 32
5.2.2 Wi-Fi sensitivity .................................................................................. 36
5.2.3 Wi-Fi throughput targets ...................................................................... 37
5.3 Bluetooth performance ......................................................................................... 38
5.3.1 Bluetooth Tx power (TBD) .................................................................... 38
5.3.2 Bluetooth sensitivity (TBD) .................................................................. 38
5.3.3 Bluetooth throughput targets ............................................................... 39
6 Thermal Specifications ............................................................................................... 40
6.1 Thermal dissipation .............................................................................................. 40
6.2 Thermal specifications .......................................................................................... 40
6.3 Thermal management .......................................................................................... 40
6.4 Module placement recommendations ...................................................................... 41
6.5 Nonoperational module thermal storage ................................................................. 41
7 Regulatory .................................................................................................................. 42
7.1 Regulatory channel support and output power ......................................................... 42
7.2 Wi-Fi channel configuration ................................................................................... 42
7.2.1 Channel configuration – RF output power ............................................... 42
7.2.2 Channel configuration – scan ................................................................ 42
7.2.3 Output power restrictions for main geographies ...................................... 42
7.3 Regulatory and safety certification ......................................................................... 43