User's Manual
Table Of Contents
- 1 Introduction
- NOTE:
- NOTE:
- 2 Product Architecture
- 3 Electrical Specifications
- 4 Mechanical Specifications
- 5 Performance
- 1. BT in SW RF-KILL in all the tests
- 2. HB values refer to internal FE SKU
- 3. OS: Win10
- 1. Wi-Fi in SW RF-KILL in all the tests
- 2. OS: Win10
- 3. WsP is Master device
- 1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
- 2. The values relate to internal FE SKU
- 3. The values are for typical device and typical conditions
- 1. Measured at ANT port
- 2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
- 3. Max means over PVT
- NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 6 Thermal Specifications
- 7 Regulatory
- 8 Dynamic Regulatory Solution
- 9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards
- 9.1.1 Socket 1 Hybrid Key E scheme
- 9.1.2 Connectorized Hybrid Key E (2230) pin-out
- 9.1.3 Special considerations for the Hybrid Key E scheme
- 9.1.4 Soldered-down (1216) pin-out
- 9.1.5 Breakout example for JfP soldered-down module
- 9.1.6 Signal connection pitfalls
- 9.1.7 Pullups and pulldowns
- 9.1.8 IO connection scenarios and best practices
- 9.1.9 I/F specific guidelines
- 9.1.10 Connectivity module power control
- 9.1.11 Power supply de-coupling
- 9.1.12 Wi-Fi wireless disable and HW RF-KILL
- 9.1.13 M.2 Bluetooth HW RF-KILL
- 9.1.14 BIOS
- 9.1 Socket 1 key options for 2230 cards
Regulatory
Intel
®
Wireless-AC 9560 (Jefferson Peak)
External Product Specification (EPS) April 2017
42 Intel Confidential Document Number: 567240–1.0
7 Regulatory
7.1 Regulatory channel support and output power
Jefferson Peak provides regulatory compliance via statically-configured SKUs or DRS (Dynamic
Regulatory Solution).
For further details on the DRS scheme, refer to the DRS application note (see Section 8 8 ).
7.2 Wi-Fi channel configuration
7.2.1 Channel configuration – RF output power
The values listed in Table 5–3 represent the target power for the calibration process without antennae
gain. This value has been verified to ensure margin from the regulatory limit based on post EEPROM
factory calibration measurements using a diagnostic tool that operates the WLAN card at a ~99% DC
(Duty Cycle) taken on both the main and auxiliary antenna ports.
As part of the factory test process, Intel measures the output power of every card. Any cards that
exceed the maximum limits (EEPROM + 1 dB) will not pass the factory test. While in operation the
card adjusts TX power using a closed loop TX power calibration algorithm. To do so, a power detector
and temperature sensor are used.
Intel uses the following antenna gain value for product and country certification work: 3 dBi for
2.4 GHz and 5 dBi for 5 GHz.
Intel also incorporates a lower limit to ensure that compliance of the WLAN card is maintained. The
minimum limits are set by factory processes.
7.2.2 Channel configuration – scan
This section will be included in future revisions.
7.2.3 Output power restrictions for main geographies
Table 7–1 Output power restrictions, main geographies
Output Power (dBm)
Country/Geo 2.4 GHz
5.15 –
5.25
GHz
5.25 –
5.35
GHz
5.47 –
5.65 GHz
5.65 –
5.725 GHz
5.725 –
5.85 GHz
Unit
EU Countries EIRP
20 23 23 23
3
23
3
14 SRD dBm
> EU Countries
Cond.
1
17 18 18 18 18 9 SRD dBm
United States
2
Cond.
1000 250 250 250 250 1000 mW
> United States
2
Cond.
30 24 24 24 24 30 dBm
Canada
2
Cond.
1000
200
EIRP
250 250 250 1000 mW
Canada
2
Cond.
30 23 EIRP 24 24 24 30 dBm
India
30 23 EIRP 23 EIRP N/A N/A 23 EIRP dBm
China Cond.
18 18 24 24 27 dBm