User's Manual
Table Of Contents
- 1 Introduction
- NOTE:
- NOTE:
- 2 Product Architecture
- 3 Electrical Specifications
- 4 Mechanical Specifications
- 5 Performance
- 1. BT in SW RF-KILL in all the tests
- 2. HB values refer to internal FE SKU
- 3. OS: Win10
- 1. Wi-Fi in SW RF-KILL in all the tests
- 2. OS: Win10
- 3. WsP is Master device
- 1. The TX power per MCS relate to IEEE, mask compliance and limited by regulatory TX power limits.
- 2. The values relate to internal FE SKU
- 3. The values are for typical device and typical conditions
- 1. Measured at ANT port
- 2. Typical means Nominal corner, AVG over non BE CHs. AVG over freq segment and chains
- 3. Max means over PVT
- NOTE: The throughput values relate to Intel® Skylake Platform and CPU, Single User.
- 6 Thermal Specifications
- 7 Regulatory
- 8 Dynamic Regulatory Solution
- 9 Platform Design Guidelines
- 9.1 Socket 1 key options for 2230 cards
- 9.1.1 Socket 1 Hybrid Key E scheme
- 9.1.2 Connectorized Hybrid Key E (2230) pin-out
- 9.1.3 Special considerations for the Hybrid Key E scheme
- 9.1.4 Soldered-down (1216) pin-out
- 9.1.5 Breakout example for JfP soldered-down module
- 9.1.6 Signal connection pitfalls
- 9.1.7 Pullups and pulldowns
- 9.1.8 IO connection scenarios and best practices
- 9.1.9 I/F specific guidelines
- 9.1.10 Connectivity module power control
- 9.1.11 Power supply de-coupling
- 9.1.12 Wi-Fi wireless disable and HW RF-KILL
- 9.1.13 M.2 Bluetooth HW RF-KILL
- 9.1.14 BIOS
- 9.1 Socket 1 key options for 2230 cards
Intel
®
Wireless-AC 9560 (Jefferson Peak)
April 2017 External Product Specification (EPS)
Document Number: 567240–1.0 Intel Confidential 5
Table 5–3 Tx power per MCS (TBD) ...................................................................................32
Table 5–4 Wi-Fi sensitivity ................................................................................................36
Table 5–5 Wi-Fi throughput ..............................................................................................37
Table 5–6 Bluetooth Tx power (TBD) ..................................................................................38
Table 5–7 Bluetooth sensitivity (TBD) ................................................................................38
Table 5-8 Bluetooth throughput targets .............................................................................39
Table 6–1 Thermal dissipation ...........................................................................................40
Table 6–2 Thermal management .......................................................................................40
Table 6–3 Storage conditions ............................................................................................41
Table 7–1 Output power restrictions, main geographies ........................................................42
Table 7–2 Wi-Fi safety and regulatory USA .........................................................................43
Table 7–3 Wi-Fi safety and regulatory Europe .....................................................................43
Table 7–4 Wi-Fi safety and regulatory Japan .......................................................................43
Table 7–5 Wi-Fi safety and regulatory Australia/New Zealand ...............................................44
Table 7–6 Wi-Fi safety and regulatory other geographies ......................................................44
Table 9–1 Hybrid Key E interface mapping for different connectivity cards ..............................51
Table 9–2 Socket 1 pullups and pulldowns ..........................................................................55
Table 9–3 CNVio recommended parameters ........................................................................57