User Manual

Specifications
ZigBit™ 2.4 GHz Amplified Wireless Modules 3-14
8228B–MCU Wireless–06/09
3.4 Mounting Information
The below diagrams show the PCB layout recommended for ZigBit Amp module. Neither via-holes nor
wires are allowed on the PCB upper layer in area occupied by the module. As a critical requirement,
RF_GND pins should be grounded via several holes to be located right next to pins thus minimizing
inductance and preventing both mismatch and losses.
Figure 3-4. ATZB-A24-UFL/U0 PCB Recommended Layout, Top View
3.5 Soldering Profile
The J-STD-020C-compliant soldering profile is recommended according to Table 3-7.
Note: 1. The package is backward compatible with PB/Sn soldering profile.
Table 3-7. Soldering profile
(1)
Profile Feature Green package
Average ramp-up rate (217°C to peak) 3°C/s max
Preheat tempearture 175°C ± 25°C 180s max
Temperature maintained above 217°C 60s to 150s
Time within 5°C of actual peak temperature 20s to 40s
Peak temperature range 260°C
Ramp-down rate 6°C/s max
Time within 25°C to peak temperature 8 minuts max