Specifications

Autel Intelligent Tech. Corp., Ltd GOC-Q82008W V1.2 Bluetooth Module Hardware Specification
Autel Intelligent Tech. Corp., Ltd
3
Contents
1. Introduction .............................................................................................................................. 4
1.1 Module Block Diagram ................................................................................................... 4
1.2 Features ........................................................................................................................... 4
1.3 Application ...................................................................................................................... 5
2. Main Specification Instruction ................................................................................................. 6
3. Pin Diagram And Description .................................................................................................. 7
3.1 Pin Diagram..................................................................................................................... 7
3.2 Pin Definition .................................................................................................................. 7
3.3 PCB Layout Footprint ..................................................................................................... 9
4. UART Interface ..................................................................................................................... 10
5. PCM Imterface ....................................................................................................................... 11
6. USB Interface......................................................................................................................... 15
7. Electrical Characteristics ....................................................................................................... 16
7.1 Absolute Maximum Ratings ......................................................................................... 16
7.2 Recommended Operating Conditions ........................................................................... 16
8.
Recommended Reflow Profile ............................................................................................... 16
9. PCB Layout Recommendation .............................................................................................. 17
9.1 HCI UART Lines Layout Guideline ............................................................................. 17
9.2 PCM Lines Layout Guideline ....................................................................................... 17
9.3 Power Trace Lines Layout Guideline............................................................................ 17
9.4 Ground Lines Layout Guideline .................................................................................... 17
10. Module Part Number Description ........................................................................................ 17
11. Ordering Information ........................................................................................................... 17
12. Packaging Information ......................................................................................................... 18
12.1 Net Weight .................................................................................................................. 18
12.2 Package........................................................................................................................ 18
12.3 Storage Requirements ................................................................................................. 18
12.4 Humidity Sensitive Characteristic ............................................................................... 18